The iSTORMY project will propose an innovative and interoperable hybrid stationary energy storage system based on: modular battery pack (stacks/modules) + modular power electronics (PE) interface + universal Self-healing energy management strategy (SH-EMS). In particular the project will investigate and demonstrate: 1. Modular battery pack with hybridization at stacks/modules level (incl. slave pBMS) with a new universal BMS (adaptive interfaces + accurate SoX) at the top of the battery system for easy and fast integration and control. The hybridization will consist of different battery types or same type with different capacities (first and second life) and a smart modular solution will be developed to integrate the cooling system among modules or stacks. 2. Modular PE interface based on SiC devices with high efficiency (topology + adaptive local controller) and Digital Twin modeling. 3. Universal SH-EMS (based on machine learning and online algorithms) including the aging and thermal constraints for failure mechanisms.

The overall objective of the PIn3S project is to realize Pilot Integration of 3nm Semiconductor technology. This covers Process Integration, creation of Lithography Equipment, EUV Mask Repair Equipment and Metrology tools capable to deal with 3D structures, defects analysis, overlay and feature size evaluation. Each of these objectives will be achieved by cooperation between key European equipment developers like; ASML, Zeiss, Thermo Fisher, Applied Materials, Nova, KTI involved with their suppliers, involvement of a strong knowledge network based on Universities of Germany, Heidelberg University Hospital, and the Netherland, TU Delft and the University of Twente, complemented with key Technology Institutes such as imec and Fraunhofer. The project addresses Section 15 “Electronics Components & Systems Process Technology, Equipment, Materials and Manufacturing”, Major Challenge 4 “Maintaining world leadership in Semiconductor Equipment, Materials and Manufacturing solutions” and Major Challenge 1 “Developing advanced logic and memory technology for nanoscale integration and application-driven performance” of the ECSEL JU Annual Work Plan 2018. As set out in the Multi Annual Strategic Plan 2018, PIn3S addresses the ambition for the European Equipment & Manufacturing industry for advanced semiconductor technologies to lead the world in miniaturization by supplying new equipment and materials approximately two years ahead of introduction of volume production of advanced semiconductor manufacturers. With the results of the Pin3S project the consortium builds on realizing IC manufacturers to migrate to the 3nm Technology node which enables a class of new products which have more functionality, more performance and are more power efficient. As such it will form the bases for innovations yet to come enabling solutions that address the societal challenges in communication, mobility, health care, security, energy and safety & security.

The overall objective of the IT2 project is to explore, develop and demonstrate technology options that are needed to realize 2nm CMOS logic technology extending the scaled Semiconductor technology roadmap to the next node in accordance to Moore’s law. These activities cover creation of Lithography equipment, new Processes & Modules and Metrology tools capable to create and deal with new 2nm node 3D structures, defect analysis, overlay and features. The topics addressed by the program relate to the ECSEL MASP 2019 Chapter 10; “Process Technology, Equipment, Materials and Manufacturing for electronic components and systems”, with emphasis on the following major challenge “the Extension of world leadership in Semiconductor Equipment, Materials and Manufacturing solutions” and “Developing Technology for heterogeneous System-on-Chip (SoC) Integration” of the ECSEL JU Annual Work Plan 2019. The relation of the IT2 project to world leadership regards the extension of the scaled semiconductor technology roadmaps and thereby maintain competence in advanced More Moore technology in Europe to support leading edge manufacturing. The relation of the IT2 project to the Developing Technology for heterogeneous System-on-chip Integration comes from activities regarding “System Scaling” in which technology is developed that enables wafer-to-wafer bonding creating 3D heterogeneous solutions with the aim to resolve performance limitations in power and data congestion. In regard to the annual work plan 2019, the IT2 project support the ECSEL JU objectives by contribution to the development of a strong and competitive Electronic Components and Systems (ECS) by involving many of the equipment and tool developers like; ASML, Zeiss, Thermo Fisher, Applied Materials, Nova, KLA along the value chain and knowledge institutes such as ARCNL, imec, PTB, TNO and TU/e. And by stimulating a dynamic ecosystem through through the involvement of SMEs like IBS, Recif, Reden and Unity.

The metrology domain (which could be considered as the ‘eyes and ears’ for both R&D&I and production) is a key enabler for productivity enhancements in many industries across the electronic components and system (ECS) value chain and have to be an integral part of any Cyber Physical Systems (CPS) which consist of metrology equipment, virtual metrology or Industrial internet of things (IIoT) sensors, edge and high-performance computing (HPC). The requirements from the metrology is to support ALL process steps toward the final product. However, for any given ECS technology, there is a significant trade-off between the metrology sensitivity, precision and accuracy to its productivity. MADEin4 address this deficiency by focusing on two productivity boosters which are independent from the sensitivity, precision and accuracy requirements: • Productivity booster 1: High throughput, next generation metrology and inspection tools development for the nanoelectronics industry (all nodes down to 5nm). This booster will be developed by the metrology equipment’s manufacturers and demonstrated in an industry 4.0 pilot line at imec and address the ECS equipment, materials and manufacturing major challenges (MASP Chapter 15, major challenges 1 – 3). • Productivity booster 2: CPS development which combines Machine Learning (ML) of design (EDA) and metrology data for predictive diagnostics of the process and tools performances predictive diagnostics of the process and tools performances (predictive yield and tools performance). This booster will be developed and demonstrated in an industry 4.0 pilot line at imec, for the 5nm node, by the EDA, computing and metrology partners (MASP Chapter 15, major challenge 4). The same CPS concept will be demonstrated for the ‘digital industries’ two major challenges of the nanoelectronics (all nodes down to 5nm) and automotive end user’s partners (MASP Chapter 9, major challenges 1and 3).