To face the increased needs on current consumptions, some new technologies are introduced in power conversion stages (mainly owing to the introduction of GaN transistors). Few years ago, the Si Transistors as switches was the device limiting the performance and the market was dominated by US manufacturers in a monopoly for space application with high costs (need of specific design and foundries to face the radiation environment). This also lead to EU dependence to US export control restrictions. The introduction of GaN transistors allow to get better performances and also EU non dependence as some initiative promote European supply chain (as shown in H2020 EleGaNt on-going project). But now, the main integration & performance limitation is now the controller of the power stages available in the market : - Performance : limited switching frequency operation due to : o Device technology : most of them in the market are in bipolar technology (slow & power consumption) o Radiation sensitivity : heavy ions can cause transients that are to be filtered (slowing down the performances) o Power consumption of the controller itself Functionality : Many functions are set owing to external parts (fine analog tuning, switching fThe SCOPS (Scalable Controller fOr Power Sources) This project sets one clear and measurable main objective: To design and evaluate the performance in space environment of Application Specific Integrated Circuit, nameds SCOPS, to control several power supply phases in parallel, using non-dependent supply chain. To do so, it is necessary that SCOPS provides the Space Community with: 1. A flexible SCOPS Circuit that overcomes the limitations of existing controllers in terms of phase paralleling possibilities, performance, feature and radiation robustness. 2. A fair commercialization and intellectual property management to allow the purchase of the SCOPS outcomes at a competitive cost in front of its non-European alternatives for space applications.

Space Market is liviSpace Market is living a mutation with the emergence of NewSpace, promoting integration/miniaturization, satellite acceleration, cost-efficient and cost-reduction approaches for all mission types: Earth Observation, Science, Telecom, Navigation and Robotic Exploration. Accordingly, middle range ASIC solutions are in competition with high performance/high capacity FPGA, new multicore devices and Rad Tolerant parts and COTS. Indeed, Mixed Signal ASIC solutions offer functional added value for testability of electronic units and digitalization of full analog functions. Hence, the PROMISE project sets clear and measurable objectives to optimize the design cost, shorten schedule and de-risk analog and mixed ASIC radhard design, manufacturing and qualification by covering the needs of the space industry. More specifically, PROMISE will provide the space community with a flexible mixed signal ASIC architecture design ecosystem built on a portfolio of hardened features. The project will also provide a flexible mixed signal ASIC manufacturing and qualification ecosystem. Last but not least, PROMISE will deliver IP dissemination, commercialization and intellectual property management to allow efficient reuse of the project’s outcomes and efficient environment for new IPs and mid-range ASIC design for space applications. PROMISE, led by Thales Alenia Space, encompasses diverse European partners, subcontractors, potential users or solution providers, all top actors of the European Mixed Signal ASIC ecosystem. The market for mega constellations is in full swing and several initiatives promoted by different operators are already underway. Thanks to PROMISE, a 50 % market share will be reached, so an estimate of 706 satellites will be delivered within a period of 5 years. Assuming only 1 PROMISE based ASIC per constellation and at least 4 pieces of this ASIC per satellite, this means more than 2800 units will be delivered in the first 5 years after the project.

The DUROC project sets clear and measurable main objectives to reach a TRL 4 from TRL 2 as follows in 2 years: • Specifiy and design the next generation of ultra-programmable SoC (ULTRA7) taking benefit of leasson learnt from DAHLIA project (TRL 2) • Introduce the ARM 73 processor for very high performance processing specificly designed for advanced process node • Validate the SoC on a rad-hard demonstrator in 7nm FinFET technology from TSMC (TRL 4) • Validate reliability and radiation hardening performance of 7nm FinFET (TRL 4) • Propose a strategy and development plan up to flight model for the next ultra-reprogrammable SoC (ULTRA7) • Define the right approach for future SiP use in space applications At the end of the project, Europe will have all required technical information to be in a position to develop multiple components (SoC FPGA, ASIC etc) on 7nm FinFET which will be the most advanced process node for space. DUROC will bring Europe to an unprecedent leadership position in VLSI electronic for space. DUROC will be the first critial step to develop the next generation of ultra-reprogrammable SoC after NG-ULTRA. The ULTRA 7 will target the following objectives: • MPSoC ARM A73 64-bit processor scalability combining ARM R52 real-time control • More than 35 000 DMIPS (Millions Instructions per Second) • Radiation hardening reliability meeting space payload and platform applications requirements

The Automotive HMI (Human Machine Interface) will soon undergo dramatic changes, with large plastic dashboards moving from the ‘push-buttons’ era to the ‘tactile’ era. User demand for aesthetically pleasing and seamless interfaces is ever increasing, with touch sensitive interfaces now commonplace. However, these touch interfaces come at the cost of haptic feedback, which raises concerns regarding the safety of eyeless interact ion during driving. The HAPPINESS project intends to address these concerns through technological solutions, introducing new capabilities for haptic feedback on these interfaces. The main goal of the HAPPINESS project is to develop a smart conformable surface able to offer different tactile sensations via the development of a Haptic Thin and Organic Large Area Electronic technology (TOLAE), integrating sensing and feedback capabilities, focusing on user requirements and ergonomic designs. To this aim, by gathering all the value chain actors (materials, technology manufacturing, OEM integrator) for application within the automotive market, the HAPPINESS project will offer a new haptic Human-Machine Interface technology, integrating touch sensing and disruptive feedback capabilities directly into an automotive dashboard. Based on the consortium skills, the HAPPINESS project will demonstrate the integration of Electro-Active Polymers (EAP) in a matrix of mechanical actuators on plastic foils. The objectives are to fabricate these actuators with large area and cost effective printing technologies and to integrate them through plastic molding injection into a small-scale dashboard prototype. We will design, implement and evaluate new approaches to Human-Computer Interaction on a fully functional prototype that combines in packaging both sensors and actuator foils, driven by custom electronics, and accessible to end-users via software libraries, allowing for the reproduction of common and accepted sensations such as Roughness, Vibration and Relief.