
Mersen (France)
Mersen (France)
Funder
4 Projects, page 1 of 1
Open Access Mandate for Publications assignment_turned_in Project2021 - 2024Partners:APPLIED MATERIALS FRANCE, Mersen (France), STMICROELECTRONICS SILICON CARBIDE AB, SAINT-GOBAIN INDUSTRIEKERAMIK RODENTAL GMBH, CENTROTHERM INTERNATIONAL AG +32 partnersAPPLIED MATERIALS FRANCE,Mersen (France),STMICROELECTRONICS SILICON CARBIDE AB,SAINT-GOBAIN INDUSTRIEKERAMIK RODENTAL GMBH,CENTROTHERM INTERNATIONAL AG,SOITEC,IMA,FORSCHUNGS- UND ENTWICKLUNGSZENTRUM FACHHOCHSCHULE KIEL GMBH,Semikron (Germany),VALEO E AUTOMOTIVE FRANCE SAS,Chemnitz University of Technology,École Centrale de Lille,SAINT-GOBAIN CREE,CEA,TPLUS ENGINEERING GMBH,University of Seville,Hamm-Lippstadt University of Applied Sciences,SURAGUS (Germany),ISLE Steuerungstechnik und Leistungselektronik GmbH,FHG,EVG,STMicroelectronics (Switzerland),Robert Bosch (Germany),IUNET,RHEINLAND-PFALZISCHE TECHNISCHE UNIVERSITAT,NANO-JOIN GMBH,PREMO S.A.U.,VSCM,AIXTRON SE,PREMO SL,NOVASiC (France),HPE,SOITEC LAB,DANFOSS SILICON POWER GMBH,BUT,LASERTEC USA INC,LiUFunder: European Commission Project Code: 101007237Overall Budget: 89,021,400 EURFunder Contribution: 20,564,300 EURSilicon Carbide based power electronics use electrical energy significantly more efficient than current silicon-based semiconductors: gains from 6% to 30% are expected depending on application. TRANSFORM will provide European downstream market players with a reliable source of SiC components and systems based on an entirely European value chain - from substrates to energy converters. Its technical excellence strengthens the global competitive position of Europe. TRANSFORM improves current SiC technologies beyond state-of-the-art to serve large emerging markets for electric power conversion in renewable energies, mobility and industry. Substrate manufacturing process innovation will establish a new global standard: smart-cut technology allows high scalability, superior performance and reliability. Substrate and equipment manufacturers plus technology providers cooperate to increase maturity of the new processes from lab demonstration to pilot lines. Device manufacturers develop and tailor processes and device design based on the new substrate process, including adaptation of planarMOS and development of new TrenchMOS technology. Performance and reliability of devices is expected to increase greatly. For exploiting the potential of SiC devices, integration technologies and system design are improved concurrently, including new copper metallization processes for higher reliability and performance, module integration for high reliability and reduction of cost, and dedicated integrated driver technologies to optimize switching modes and parallel operation in high current applications. The project will demonstrate energy savings in applications (DC/AC, DC/DC, AC/DC) in the renewable energy domain, industry and automotive. TRANSFORM contributes to European societal goals and the green economy through significantly increasing energy efficiency by providing a competitive, ready-to-industrialized technology, strengthening Europes technological sovereignty in a critical field.
more_vert Open Access Mandate for Publications and Research data assignment_turned_in Project2025 - 2028Partners:CEA, University of Catania, ST, STMicroelectronics (Malta), SCREEN SPE GERMANY GMBH +47 partnersCEA,University of Catania,ST,STMicroelectronics (Malta),SCREEN SPE GERMANY GMBH,THERMO FISHER SCIENTIFIC (BREMEN) GMBH,CS CLEAN SOLUTIONS GmbH,VARIOLYTICS GMBH,HQ-Dielectrics (Germany),GASERA,SINTEF AS,ICRA,SOITEC,SCHMIDT + HAENSCH GMBH & CO,LEONARDO,IMEC,Robert Bosch (Germany),UCL,University of Leicester,THERMO ONIX LTD,PIBOND,VOCSENS,TNO,University of Rome Tor Vergata,UCC,Arkema (France),CENTROTHERM CLEAN SOLUTIONS GMBH,FATH GMBH,FEI,ISL,AALTO,Mersen (France),MOLYMEM LIMITED,Pfeiffer Vacuum (France),SEMI Europe,STMicroelectronics (Switzerland),TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,TOKYO ELECTRON EUROPE LIMITED,Infineon Technologies (Germany),Besi Netherlands BV,EDWARDS LTD,WEEECYCLING,PICOSUN OY,MERCK ELECTRONICS KGAA,NXP (Netherlands),University of Malta,AIXTRON SE,LAYERONE AS,STM CROLLES,TechnipFMC (France),FHG,Polytechnic University of MilanFunder: European Commission Project Code: 101194246Overall Budget: 46,626,100 EURFunder Contribution: 13,965,000 EURGENESIS, backed by Horizon Europe, aims to make semiconductor manufacturing sustainable, aligning with the European Green Deal, by minimizing environmental impact with eco-friendly innovations. [Objectives] GENESIS aims to replace harmful materials with safer options, improve waste management, and enhance the use and recyclability of scarce materials. [Innovations] GENESIS introduces innovations in three key areas: • Innovative materials: PFAS-free polymer and eco-friendly gas alternatives complying with EU regulations. • Waste & emissions monitoring: Cutting-edge sensors detect hazardous substances for efficient aqueous and gas waste elimination, reducing environmental and health risks. • Scarce material management: New integration technologies optimize material usage and initiate recycling of scarce materials like Gallium, Niobium, and silicon carbide. [Methodology] GENESIS employs four technical work packages to research sustainable material substitution, emission reduction, and resource management. This modular approach promotes scalability and integration with existing processes, fostering a circular economy in the semiconductor sector. Supervised by management work packages, it quantifies environmental efficiency and engages in dissemination to promote European technological achievements [Outcomes] The project targets a 50% cut in hazardous materials, 30% decrease in emissions and waste, and improved scarce material recyclability, boosting EU semiconductor sustainability and global competitiveness. [Impact] GENESIS supports EU's tech sovereignty and resilience through accurate monitoring and sustainable practices. It positions Europe as a leader in sustainable semiconductor tech, setting new standards for impact-oriented communication and dissemination.
more_vert assignment_turned_in ProjectFrom 2006Partners:Mersen (France), AMU, SOLDERD, Grenoble INP - UGA, CEA CENTRE DE GRENOBLEMersen (France),AMU,SOLDERD,Grenoble INP - UGA,CEA CENTRE DE GRENOBLEFunder: French National Research Agency (ANR) Project Code: ANR-06-PSPV-0011Funder Contribution: 534,442 EURmore_vert Open Access Mandate for Publications and Research data assignment_turned_in Project2024 - 2027Partners:TUW, EEMCO GMBH, AMX AUTOMATRIX SRL, ECM TECHNOLOGIES, SOITEC +24 partnersTUW,EEMCO GMBH,AMX AUTOMATRIX SRL,ECM TECHNOLOGIES,SOITEC,Chemnitz Power Labs,HERAEUS ELECTRONICS GMBH & CO. KG,KAI,Chemnitz University of Technology,VSCM,CEA,VALEO EAUTOMOTIVE GERMANY GMBH,ZADIENT TECHNOLOGIES,Infineon Technologies (Austria),BL,UAB TERAGLOBUS,Ibs (France),Mersen (France),Robert Bosch (Germany),Infineon Technologies (Germany),ECM GREENTECH,IRT ANTOINE DE SAINT EXUPERY,SICREATE GMBH,SERMA TECHNOLOGIES,GRASS POWER ELECTRONICS GMBH,STU,FHG,RWTH,University of BucharestFunder: European Commission Project Code: 101139788Overall Budget: 96,869,904 EURFunder Contribution: 23,394,900 EURFastLane targets a full, highly competitive and sustainable European value chain for Silicon Carbide (SiC) based power electronics. The goal is to provide a competitive technology excellence from engineered SiC substrates to novel devices, smart power modules and converters to broadened automotive and industrial applications. The next generation of SiC materials will be developed by improved quality of the crystalline starting material, material re-use and acceleration of substrate EU-based manufacturing. Based on the new materials the next generation SiC MOSFET power devices will be developed overcoming current limitations regarding efficiency, performance, robustness and sustainability and will integrate also new on-chip sensing technology. Power modules based on the devices will be further improved by several innovations, e.g. advanced sintering which will lead to improved power module reliability and therefore better sustainability. On component level, highly efficient and reliable inverters for automotive and industrial applications will be developed, including a variety of innovations in detail. In all steps, an improvement of SiC material characterization methodologies will increase the quality and the output of EU based semiconductors. Overall, performance and reliability are expected to increase greatly in all steps. These developments will lead to an overall reduction of cost and, by reduction of the footprint (lifetime increase, CO2 decrease, water consumption decrease), to a greener economy. With the envisioned goals, FastLane will decrease the environmental footprint all along the product lifecycle and contribute to the European Green Deal and ensure a sustainable European sovereignty in power electronics. Cost benefits for the end user will be achieved by the reuse of the automotive economy of scale. With these steps, FastLane contributes to the European societal goals and a greener economy.
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