
Silicon Radar (Germany)
Silicon Radar (Germany)
8 Projects, page 1 of 2
assignment_turned_in Project2012 - 2016Partners:CEA, Silicon Radar (Germany), IXYS SAN SEBASTIAN SA, STMicroelectronics (Switzerland), FHG +4 partnersCEA,Silicon Radar (Germany),IXYS SAN SEBASTIAN SA,STMicroelectronics (Switzerland),FHG,SIVERS IMA AKTIEBOLAG,NOKIA SOLUTIONS AND NETWORKS ITALIA SPA,CEIT,OTEFunder: European Commission Project Code: 317957more_vert Open Access Mandate for Publications assignment_turned_in Project2020 - 2024Partners:FHG, Sony Europe B.V., TUD, SILTRONIC AG, FORD OTOMOTIV SANAYI ANONIM SIRKETI +36 partnersFHG,Sony Europe B.V.,TUD,SILTRONIC AG,FORD OTOMOTIV SANAYI ANONIM SIRKETI,Bundeswehr,MunEDA,Bundeswehr University Munich,VIC,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,MIKROELEKTRONIK LTD,TU Delft,CEA,Silicon Radar (Germany),University of Bucharest,Sequans Communications (France),Anteverta,BUYUTECH TEKNOLOJI SANAYI VE TICARET ANONIM SIRKETI,RFBEAM MICROWAVE GMBH,STGNB 2 SAS,Lund University,SOITEC,EAB,D&R,IMEC,TRAXENS,FLAVIA IT-Management GmbH,STM CROLLES,KTH,MU,BMVg,Institut Polytechnique de Bordeaux,NI,ARBE ROBOTICS LTD,TURKCELL,UCL,Gdańsk University of Technology,TÜBİTAK,SMART IS MAKINALARI SANAYI VE TICARET ANONIM SIRKETI,ASYGN,AEDFunder: European Commission Project Code: 876124Overall Budget: 95,317,296 EURFunder Contribution: 24,640,000 EURThe overarching goal of BEYOND5 is to build a completely European supply chain for Radio-Frequency Electronics enabling new RF domains for sensing, communication, 5G radio infrastructure and beyond. BEYOND5 is first and foremost a technology project gathering most significant European actors covering the entire value chain from materials, semiconductor technologies, designs and components up to the systems. BEYOND5 will drive industrial roadmaps in More than Moore (MtM) in adding connectivity features on existing CMOS Technology. The ambition is to accomplish sustainable Radio Frequency SOI platforms to cover the frequency range from 0.7GHz to more than 100GHz, and to demonstrate the technical advantage of SOI, which allows combining large scale integration, low power consumption, cost competitiveness and higher reliability; thus, resulting in high volume production of trusted components with low environmental impact in Europe. This objective will be achieved in a “Time to Market” approach using the 3 major work streams: 1. Technology enhancement in three European industrial pilot lines: • 300mm RF SOI substrates pilot line in Soitec, supported by the “Substrate Innovation Center” in CEA LETI to prepare future generations. • RF-SOI 65nm pilot line for 5G FEM in ST addressing both sub-6GHz and 28GHz domains. • 22FDX pilot line addressing Digital Signal Processing of radio module and RF reliability, in GF 2. European RF design ecosystem strengthening, based on a large fabless community using FD-SOI and RF-SOI platforms 3. Six Leading edge systems aggregating the value chain to demonstrate added-value of the technology at the user level: • NB IoT for Smart Asset Tracking, • Contactless USB for high-data rate communication, • V2X for autonomous connected trucks, • 5G Low Power Digital Beamforming Base Station for Indoor dense spaces, • Automotive MIMO Radar with embedded AI, • Car Interior Radar for passenger monitoring.
more_vert assignment_turned_in Project2011 - 2015Partners:TopGaN, COVENTOR SARL, OMMIC SAS, FOI, Silicon Radar (Germany) +12 partnersTopGaN,COVENTOR SARL,OMMIC SAS,FOI,Silicon Radar (Germany),UoA,Thalgo (France),IHP GMBH,FHG,EADS DEUTSCHLAND GMBH,SHT,Uppsala University,University of Ulm,Alfa Imaging (Spain),INSTITUTUL NATIONAL DE CERCETAREDEZVOLTARE PENTRU MICROTEHNOLOGIE,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,THALESFunder: European Commission Project Code: 288531more_vert Open Access Mandate for Publications assignment_turned_in Project2017 - 2021Partners:Elmos Semiconductor (Germany), Nokian Tyres (Finland), CEA, Silicon Radar (Germany), ADVANCED VACUUM +24 partnersElmos Semiconductor (Germany),Nokian Tyres (Finland),CEA,Silicon Radar (Germany),ADVANCED VACUUM,BESI,Murata (Japan),MICRO ANALOG SYSTEMS OY,AMIC,NANOTEST,VALEO VISION SYSTEMS,INNOSENT,NXP,NANIUM S.A.,3DIS TECHNOLOGIES,Murata (Finland),PACKAGING SIP,Besi Netherlands BV,FHG,TEXEDA DESIGN GMBH,Sencio,EVG,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,PAC TECH,Afore Oy,KETEK GMBH HALBLEITER-UND REINRAUMTECHNIK,SEMILAB ZRT,ROODMICROTEC,SPINVERSE OYFunder: European Commission Project Code: 737497Overall Budget: 29,735,000 EURFunder Contribution: 7,203,640 EURna
more_vert assignment_turned_in Project2009 - 2013Partners:HIGHTEC, Robert Bosch (Germany), Silicon Radar (Germany), IHP GMBH, KIT +5 partnersHIGHTEC,Robert Bosch (Germany),Silicon Radar (Germany),IHP GMBH,KIT,ST,STMicroelectronics (Switzerland),SELMIC LTD,UNIVERSITY OF TORONTO,Evatronix IPFunder: European Commission Project Code: 248120more_vert
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