
Elmos Semiconductor (Germany)
Elmos Semiconductor (Germany)
5 Projects, page 1 of 1
Open Access Mandate for Publications assignment_turned_in Project2017 - 2021Partners:Elmos Semiconductor (Germany), Nokian Tyres (Finland), CEA, Silicon Radar (Germany), ADVANCED VACUUM +24 partnersElmos Semiconductor (Germany),Nokian Tyres (Finland),CEA,Silicon Radar (Germany),ADVANCED VACUUM,BESI,Murata (Japan),MICRO ANALOG SYSTEMS OY,AMIC,NANOTEST,VALEO VISION SYSTEMS,INNOSENT,NXP,NANIUM S.A.,3DIS TECHNOLOGIES,Murata (Finland),PACKAGING SIP,Besi Netherlands BV,FHG,TEXEDA DESIGN GMBH,Sencio,EVG,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,PAC TECH,Afore Oy,KETEK GMBH HALBLEITER-UND REINRAUMTECHNIK,SEMILAB ZRT,ROODMICROTEC,SPINVERSE OYFunder: European Commission Project Code: 737497Overall Budget: 29,735,000 EURFunder Contribution: 7,203,640 EURna
more_vert Open Access Mandate for Publications assignment_turned_in Project2016 - 2019Partners:Elmos Semiconductor (Germany), Semikron (Germany), IT, TUD, Robert Bosch (Germany) +33 partnersElmos Semiconductor (Germany),Semikron (Germany),IT,TUD,Robert Bosch (Germany),Polytechnic University of Milan,SYSTEMA,AIT,Hochschule Mittweida,TUW,Infineon Technologies (Austria),MCL,IFD,Schiller Automatisierungstechnik GmbH,PLANSEE SE,PMX,Know Center,FHG,University of Aveiro,MLAB,Ibs (France),CMF,ifak e. V. Magdeburg,NANIUM S.A.,IFKL,AAU,FhA,Fabmatics (Germany),Infineon Technologies (Germany),KAI,UNIPV,AVL,AT&S (Austria),VIF,LPE,Roth & Rau - Ortner GmbH,znt Zentren für Neue Technologien GmbH,HOCHSCHULE FUR ANGEWANDTE WISSENSCHAFTEN BURGENLAND GMBHFunder: European Commission Project Code: 692466Overall Budget: 61,919,600 EURFunder Contribution: 12,227,400 EURAddressing European Policies for 2020 and beyond the “Power Semiconductor and Electronics Manufacturing 4.0” (SemI40) project responds to the urgent need of increasing the competitiveness of the Semiconductor manufacturing industry in Europe through establishing smart, sustainable, and integrated ECS manufacturing. SemI40 will further pave the way for serving highly innovative electronic markets with products powered by microelectronics “Made in Europe”. Positioned as an Innovation Action it is the high ambition of SemI40 to implement technical solutions on TRL level 4-8 into the pilot lines of the industry partners. Challenging use cases will be implemented in real manufacturing environment considering also their technical, social and economic impact to the society, future working conditions and skills needed. Applying “Industry 4.0”, “Big Data”, and “Industrial Internet” technologies in the electronics field requires holistic and complex actions. The selected main objectives of SemI40 covered by the MASP2015 are: balancing system security and production flexibility, increase information transparency between fields and enterprise resource planning (ERP), manage critical knowledge for improved decision making and maintenance, improve fab digitalization and virtualization, and enable automation systems for agile distributed production. SemI40’s value chain oriented consortium consists of 37 project partners from 5 European countries. SemI40 involves a vertical and horizontal supply chain and spans expertise and partners from raw material research, process and assembly innovation and pilot line, up to various application domains representing enhanced smart systems. Through advancing manufacturing of electronic components and systems, SemI40 contributes to safeguard more than 20.000 jobs of people directly employed in the participating facilities, and in total more than 300.000 jobs of people employed at all industry partners’ facilities worldwide.
more_vert assignment_turned_in Project2008 - 2011Partners:Elmos Semiconductor (Germany), ELMOS ADVANCED PACKAGING B.V., COVENTOR SARL, ΘΕΩΝ ΑΙΣΘΗΤΗΡΕΣ Α.Ε.Β.Ε., ELMOS Central IT Services +6 partnersElmos Semiconductor (Germany),ELMOS ADVANCED PACKAGING B.V.,COVENTOR SARL,ΘΕΩΝ ΑΙΣΘΗΤΗΡΕΣ Α.Ε.Β.Ε.,ELMOS Central IT Services,University of Siegen,THE CHANCELLOR, MASTERS AND SCHOLARS OF THE UNIVERSITY OF CAMBRIDGE,X-FAB SEMICONDUCTOR,PROCESS RELATIONS GMBH,IPD,IVAM EVFunder: European Commission Project Code: 213969more_vert Open Access Mandate for Publications assignment_turned_in Project2018 - 2021Partners:Ibermática (Spain), Elmos Semiconductor (Germany), TUD, SYSTEMA, AIT +35 partnersIbermática (Spain),Elmos Semiconductor (Germany),TUD,SYSTEMA,AIT,camLine,YAZZOOM,University of Bucharest,SIRRIS,Infineon Technologies Romania and CO. Societate in Comandita Simpla,IFD,UTC-N,University of Hagen,INFINEON TECHNOLOGIES ITALIA Srl,CISC Semiconductor (Austria),Regensburg University of Applied Sciences,G&D,Know Center,UNIMIB,WHZ,FHG,TTTECH INDUSTRIAL AUTOMATION AG,Dresden University of Applied Sciences,ECCENCA,TUW,Infineon Technologies (Austria),Zittau/Görlitz University of Applied Sciences,TTTech Computertechnik (Austria),University of Siegen,JEMA,IFKL,EVOLARIS,AAU,Infineon Technologies (Germany),WU,KAI,AKTING,AVL,TECNALIA,VIFFunder: European Commission Project Code: 783163Overall Budget: 47,021,900 EURFunder Contribution: 10,896,500 EURThe main objective of the iDev40 project proposal is to achieve a disruptive or “breakthrough change” step toward speedup in time to market by digitalising the European industry, closely interlinking development processes, logistics and manufacturing. Ultimately, the project aims at suitable digital technology advancements to strengthen the electronic components and systems industry in Europe. It addresses various industrial domains with one and the same approach of digitalisation towards competitive and innovative solutions. The new concept of introducing seamlessly integrated development together with automation and network solutions as well as enhancing the transparency of data, their consistence, flexibility and overall efficiency will lead to a significant speedup in the time to market (T2M) race. iDev40’s unique approach addresses: • AI learning, Data Life Cycle Management and IP Protection • Embedding Digital Development in Digital Production (the digital twin) • Close the Knowledge loop in product life cycle management along the supply chain • Collaboration 4.0 and Development of highly skilled R&D and Manufacturing Teams • Prove the innovated technologies on selected use cases in real productive environment Progress in mastering these challenges will significantly impact the productivity of future design processes embedded in an Industrial Internet environment. The global state-of-art technologies already offer tremendous diagnostics algorithms, machine controls, simulators, optimizers, etc., but only an extensive framework like iDev40 can combine them into effective integration into the development process enabling such powerful simulations like “digital twins” that ever more govern the hardware, manufacturing service and business functions. To cope with the exceptional complexity it becomes even more crucial to be competitive leaders in developing virtual representations of real physical implementation.
more_vert Open Access Mandate for Publications assignment_turned_in Project2020 - 2023Partners:Elmos Semiconductor (Germany), University of L'Aquila, SCHWEIZER ELECTRONIC AG, FTZ, TUD +80 partnersElmos Semiconductor (Germany),University of L'Aquila,SCHWEIZER ELECTRONIC AG,FTZ,TUD,NANODESIGN,University of Bremen,IWO,ULMA Embedded Solutions,INFINEON TECHNOLOGIES ITALIA Srl,INMOTION TECHNOLOGIES AB,RISE,ON SEMICONDUCTOR TECHNOLOGY,BATZ,Ikerlan,Carlos III University of Madrid,TU Delft,SIRRIS,ELAPHE PROPULSION TECHNOLOGIES LTD,Graz University of Technology,IFD,TEKNE,GPL,EDR & MEDESO,PAVO TASARIM URETIM ELEKTRONIK TICARET ANONIM SIRKETI,HSG-IMIT,FORCIOT OY,Chemnitz University of Technology,CSIC,ENFORMA BILISIM,WHZ,FHG,PUMACY,Okmetic,IUNET,UMT,TUW,Infineon Technologies (Austria),BelGaN,UMS,WAT MOTOR,MCL,IMEC,RBDD,AALTO,MU,NANIUM S.A.,LFOUNDRY SRL,JSI,IFKL,UNIVERSITE LYON 1 CLAUDE BERNARD,THE REUSE COMPANY,X-FAB Dresden,Scania (Sweden),PLASTIC OMNIUM ADVANCED INNOVATIONAND RESEARCH,KAI,NEXPERIA BV,UCLM,IVF,X-FAB SEMICONDUCTOR,NINIX TECHNOLOGIES NV,Infineon Technologies (Germany),Plastic Omnium (France),TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,BSH,Screentec,STU,III V Lab,SENSITEC GMBH,JIACO INSTRUMENTS BV,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,HAN,LIS,TECNOLOGICA,AVL,AT&S (Austria),THALES,VIF,ARCELIK,MINDCET NV,QRTECH,Ams AG,Signify Netherlands BV,CAF,LEC GMBHFunder: European Commission Project Code: 876659Overall Budget: 102,525,000 EURFunder Contribution: 24,862,600 EURIntelligent Reliability 4.0 (iRel40) has the ultimate goal of improving reliability for electronic components and systems by reducing failure rates along the entire value chain. Trend for system integration, especially for heterogeneous integration, is miniaturization. Thus, reliability becomes an increasing challenge on device and system level and faces exceptional requirements for future complex applications. Applications require customer acceptance and satisfaction at acceptable cost. Reliability must be guaranteed when using systems in new and critical environments. In iRel40, 79 partners from 14 countries collaborate in 6 technical work packages along the value chain. WP1 focuses on specifications and requirements. WP2 and WP3 focus on modelling, simulation, materials and interfaces based on test vehicles. WP4 applies the test vehicle knowledge to industrial pilots related to production. WP5 applies the knowledge to testing. WP6 focuses on application use cases applying the industrial pilots. We assess and validate the iRel40 results. Reliable electronic components and systems are developed faster and new processes are transferred to production with higher speed. Crucial insight gained by Physics of Failure and AI methods will push overall quality levels and reliability. iRel40 results will strengthen production along the value chain and support sustainable success of Electronic Components and Systems investment in Europe. By collaboration between academy, industry and knowledge institutes on this challenging topic of reliability, the project secures more than 25.000 jobs in the 25 participating production and testing sites in Europe. The project supports new applications and reliable chips push applications in energy efficiency, e-mobility, autonomous driving and IoT. This unique project brings, for the first time ever, world-leading reliability experts and European manufacturing expertise together to generate a sustainable pan-European reliability community.
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