SUSS MicroTec (Germany)

corporate_fareorganization

Web page: https://www.suss.com/en

Country: Germany

Wikidata: Q2382257

ROR: https://ror.org/05vcgwf09

SUSS MicroTec (Germany)

- Funding / Projects
  (4)

4 Projects, page 1 of 1

SEAL (Semiconductor Equipment Assessment Leveraging Innovation)
assignment_turned_inProject2010 - 2013Partners:Landshut Silicon Foundry, adixen, TPI, GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, RMT +36 partners
Landshut Silicon Foundry,
adixen,
TPI,
GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,
RMT,
FHWN,
MEMC,
SUSS MICROOPTICS,
SunEdison (United States),
ICN2,
Protec Carrier Systems GmbH,
NANDA TECHNOLOGIES GMBH,
Oxford Instruments (Germany),
RF SUNY ,
Ams AG,
SUSS MicroTec (Germany),
SUSS MicroTec Lithography GmbH,
JO AT,
Metryx,
SOITEC,
ICT Integrated Circuit Testing GmbH,
Infineon Technologies (Germany),
SUSS MicroTec Photomask Equipment,
LAM RESEARCH AG,
KLA,
ACP,
Mapper Lithography (Netherlands),
IMEC,
FHG,
AMIL,
STM CROLLES,
MIY,
Oxford Instruments (United Kingdom),
SILTRONIC AG,
Ibs (France),
SEMILAB ZRT,
CEA,
Intel (United States),
PVA-AS,
HQ-Dielectrics (Germany),
FRT GmbH
Funder: European Commission Project Code: 257379
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JEMSIP_3D (Joint Equipment and Materials for System-in-Package and 3D-Integration)
assignment_turned_inProject2009 - 2012Partners:FEI, MISSING_LEGAL_NAME, ALES, FHG, CEA +15 partners
FEI,
MISSING_LEGAL_NAME,
ALES,
FHG,
CEA,
PHILIPS ELECTRONICS NEDERLAND B.V.,
Corvinus University of Budapest,
SET,
MICRED,
SINTEF AS,
NXP (Germany),
SUSS MicroTec (Germany),
STS,
FCI MICROCONNECTIONS,
NXP (Netherlands),
Replisaurus Technologies AB,
ATOTECH,
TU Delft,
Infineon Technologies (Germany),
ASM EUROPE
Funder: European Commission Project Code: 120016
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E450EDL (European 450mm Equipment Demo Line)
assignment_turned_inProject2013 - 2016Partners:IMEC, TNO, MTA Research Centre for The Humanities, SEMILAB ZRT, AMIL +37 partners
IMEC,
TNO,
MTA Research Centre for The Humanities,
SEMILAB ZRT,
AMIL,
Semilev,
Ibs (France),
TU Delft,
LAM RESEARCH AG,
INTEL IRELAND,
Jordan Valley Semiconductors (Israel),
NVMI,
ZEISS,
Integrated Dynamics Engineering GmbH,
FEI,
adixen,
ASYS,
DEMCON,
M+W GERMANY GMBH,
REDEN,
ENTEGRIS SAS,
MTA BTK ITI,
EVG,
AIS,
FRT GmbH,
ISI AS CR,
PRODRIVE BV,
CEA,
RIBER,
Recif Technologies (France),
ART,
MISSING_LEGAL_NAME,
KLA,
ASML (Netherlands),
SUSS MicroTec (Germany),
XYCARB CERAMICS BV,
SOITEC,
MOGEMA,
Levitech,
Metryx,
ASMB,
VDL-ETG
Funder: European Commission Project Code: 325613
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ESIP (Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test)
assignment_turned_inProject2010 - 2013Partners:Siemens (Germany), CEA, VTI TECHNOLOGIES, VALTION TALOUDELLINEN TUTKIMUSKESKUS, MEMSSTAR LTD +34 partners
Siemens (Germany),
CEA,
VTI TECHNOLOGIES,
VALTION TALOUDELLINEN TUTKIMUSKESKUS,
MEMSSTAR LTD,
QUANTEMOL LIMITED,
PVA-AS,
SUSS MicroTec (Germany),
STMicroelectronics (Switzerland),
UCL,
Okmetic,
TU Delft,
Ams AG,
Infineon Technologies (Germany),
UNIBO,
ALSI,
MISSING_LEGAL_NAME,
PICOSUN OY,
EUROPEAN AERONAUTIC DEFENCE AND SPACE COMPANY EADS FRANCE SAS,
TN,
EVG,
ST TOURS,
NXP (Netherlands),
Melexis,
BTE,
Technoprobe,
INFRATEC,
AIT,
FHG,
VEREIN ZUR FORDERUNG DER ELEKTRONENMIKROSKOPIE UND FEINSTRUKTURFORSCHUNG,
IMEC,
SINTEF AS,
TNO,
ST,
Feinmetall GmbH,
SensoNor Technologies AS,
Conpart (Norway),
PHILIPS ELECTRONICS NEDERLAND B.V.,
3D PLUS
Funder: European Commission Project Code: 120227
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SUSS MicroTec (Germany)

SUSS MicroTec (Germany)

4 Projects, page 1 of 1

SEAL (Semiconductor Equipment Assessment Leveraging Innovation)

JEMSIP_3D (Joint Equipment and Materials for System-in-Package and 3D-Integration)

E450EDL (European 450mm Equipment Demo Line)

ESIP (Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test)

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