
IFD
23 Projects, page 1 of 5
Open Access Mandate for Publications assignment_turned_in Project2017 - 2021Partners:Infineon Technologies (Germany), UNICAL, Polytechnic University of Milan, INFINEON TECHNOLOGIES LINZ GMBH & CO KG, RUB +31 partnersInfineon Technologies (Germany),UNICAL,Polytechnic University of Milan,INFINEON TECHNOLOGIES LINZ GMBH & CO KG,RUB,University of Stuttgart,UNIVERSITE DE MONTPELLIER,FAU,STM CROLLES,KIT,ISD,XMOD,USTL,BUW,NSN,Sapienza University of Rome,UBx,UNIVERSITE DE LILLE,USTL,IFD,ST,UNIPV,IHP GMBH,INRAS GMBH,Saarland University,TUD,SIAE MICROELETTRONICA SPA,MUG,UM,IMEC,Alcatel-Lucent (Germany),MICRAM MICROELECTRONIC GMBH,STMicroelectronics (Switzerland),RWTH,UNIMORE,UGAFunder: European Commission Project Code: 737454Overall Budget: 42,927,600 EURFunder Contribution: 12,081,300 EURThe TARANTO project targets to break the technological barriers to the development of the next BiCMOS technology platforms, allowing the improvement of the performance of the HBT (Heterojunction Bipolar Transistors) with a much higher level of integration. This new generation of transistors HBT will be a key factor to meet the needs of high-speed communications systems and high data rate required for the integration of heterogeneous intelligent systems as well as for intelligent mobility systems that will be used in future fully automated transport systems. The main objectives of this project will be to develop transistors HBT offering high maximum frequency (Fmax: 600GHz) built to very high density CMOS processes: 130 / 90nm for IFX, 55 / 28nm to ST, while IHP will work on the project to achieve maximum frequencies of 700GHz remaining compatible with IFX and ST BiCMOS processes. The project consortium gathers the main European players in the value chain for these applications at very high frequencies, from laboratories to industrial users, thus ensuring the highest scientific level and the ability to validate the work carried out on appropriate demonstrators.
more_vert Open Access Mandate for Publications assignment_turned_in Project2019 - 2022Partners:KEMPPI OY, University of Paderborn, UPM, IWO, SILTRONIC AG +40 partnersKEMPPI OY,University of Paderborn,UPM,IWO,SILTRONIC AG,STU,AVL SOFTWARE AND FUNCTIONS GMBH,CSIC,VIF,FHG,X-FAB Dresden,BRUSA HYPOWER AG,TUD,JIACO INSTRUMENTS BV,TST,Infineon Technologies (Austria),AALTO,APC,University of Oviedo,University of Rostock,CTR,SAL,Ilmenau University of Technology,EAAT,Chemnitz University of Technology,EPFZ,Zittau/Görlitz University of Applied Sciences,ALFEN BV,University of Bremen,X-FAB SEMICONDUCTOR,INGETEAM,SGS Institut Fresenius GmbH,MI2-FACTORY GMBH,FAGOR AUTO,H and K,INFINEON TECHNOLOGIES CEGLED TELJESITMENYFELVEZETOKET GYARTO KORLATOLT FELELOSSEGU TARSASAG,ENEDO FINLAND OY,IFD,Powertec (Slovakia),MCL,BRUSA,BTE,ABB OY,TU Delft,Infineon Technologies (Germany)Funder: European Commission Project Code: 826417Overall Budget: 74,253,800 EURFunder Contribution: 16,914,100 EURThe objectives in Power2Power aim to foster a holistic, digitized pilot line approach by accelerating the transition of ideas to innovations in the Power Electronic Components and Systems domain. In the course of this project, the international leadership of the European industry in this segment will be strengthened by means of a digitized pilot line approach along the supply chain located entirely in Europe; working together with multiple organizations, combining different disciplines and knowledge areas in the heterogeneous power-ECS environment. Only these comprehensive efforts will allow reaching a high-volume production of smart power electronics to change the market towards energy-efficient applications to meet the carbon dioxide reduction goals of the European Union. Consequently, economic growth and Tackling grand societal challenges “Energy” and “Mobility” lead to safeguarding meaningful jobs for European citizens. Silicon-based power solutions will outperform new materials (SiC, GaN) for many more years in terms of cost-to-performance-ratio and reliability. Thus, the Silicon-based power solutions will keep innovating and growing the upcoming years. On a long run the project Power2Power will significantly impact the path to the industrial ambition of value creation by digitizing manufacturing and development in Europe. It fully supports this vision by addressing key topics of both pillars “Key Applications” and “Essential Capabilities”. By positioning Power2Power as innovation action, a clear focus on exploitation of the expected result is a primary goal. Smart energy utilization with highly efficient power semiconductor-based electronics is key in carefully utilizing the scarce resources. Energy generation, energy conversion and smart actors are these application domains where advanced high voltage power semiconductor components primarily impact the path toward winning innovations.
more_vert Open Access Mandate for Publications assignment_turned_in Project2019 - 2022Partners:ECL, MGEP, Gdańsk University of Technology, Latvian Academy of Sciences, WAPICE LTD WAPICE AB +81 partnersECL,MGEP,Gdańsk University of Technology,Latvian Academy of Sciences,WAPICE LTD WAPICE AB,EXPLEO GERMANY GMBH,AIT,ARCELIK,EQUA Simulation (Sweden),Jotne,KAI,VIF,CSC,POLITO,EDMS,CEA,3E,Dresden University of Applied Sciences,IFD,Robert Bosch (Germany),AVCR,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,SANTER REPLY,ABB OY,SIRRIS,Infineon Technologies (Germany),RHEINLAND-PFALZISCHE TECHNISCHE UNIVERSITAT,STMicroelectronics (Switzerland),AEE INTEC,EVOPRO INNOVATION KFT,LUNDQVIST TRAVARU AB,TU/e,ICT,EQUA SOLUTIONS AG,BEIA,Carlos III University of Madrid,LIND,FAGOR ARRASATE S COOP,THE REUSE COMPANY,ACCIONA CONSTRUCCION SA,TUD,Eurotech (Italy),ROPARDO,SAP NORWAY AS,NOVA,IECS,HiØ,ČVUT,INQUERY LABS CLOSED COMPANY LIMITEDBY SHARES,UMT,ifak e. V. Magdeburg,INCQUERY LABS RESEARCH AND DEVELOPMENT LTD,AITIA International Zrt.,Infineon Technologies (Austria),PHILIPS MEDICAL SYSTEMS NEDERLAND,Magillem Design Services,DAC.DIGITAL JOINT-STOCK COMPANY,CISC Semiconductor (Austria),FORSCHUNG BURGENLAND GMBH,IUNET,DOTGIS,ASTUCE,VUT,TECHNEXT,MONDRAGON CORPORACION COOPERATIVA SCOOP,UTIA,ASML (Netherlands),BUTE,BOSCH SOFTWARE INNOVATIONS GMBH,TECHNOLUTION BV,University of Lübeck,STGNB 2 SAS,FAGOR AUTO,CAMEA,Ikerlan,TELLU AS,SYSTEMA,VTC,ULMA Embedded Solutions,MSI,SEMANTIS INFORMATION BUILDERS GMBH,BnearIT (Sweden),PODCOMP,NTNU,BOLIDEN MINERAL AB,Luleå University of TechnologyFunder: European Commission Project Code: 826452Overall Budget: 83,757,200 EURFunder Contribution: 21,155,000 EURFor the purpose of creating digitalisation and automation solutions Arrowhead Tools adresses engineering methodologies and suitable integrated tool chains. With the global aim of substantial reduction of the engineering costs for digitalisation/automation solutions. Thus the Arrowhead Tools vision is: - Engineering processes and tool chains for cost efficient developments of digitalization, connectivity and automation systems solutions in various fields of application For the further and wider commercialisation of automation and digitalisation services and products based on SOA, Arrowhead Framework and similar technologies there is a clear need for engineerings tools that integrates existing automation and digitalisation engineering procedures and tool with SOA based automation/digitalisation technology. For this purpose the Arrowhead Tool’s grand challenges are defined as: - Engineering costs reduction by 40-60% for a wide range of automation/digitalisation solutions. - Tools chains for digitalisation and automation engineering and management, adapted to: 1. existing automation and digitalisation engineering methodologies and tools 2. new IoT and SoS automation and digitalisation engineering and management tools 3. security management tools - Training material and kits for professional engineers The results will create impact on: - Automation and digitalisation solution market - Automation and engineering efficiency and the SSBS market - Automation and digitalisation security - Competence development on engineering of automation and digitalisation solution
more_vert Open Access Mandate for Publications and Research data assignment_turned_in Project2023 - 2026Partners:Infineon Technologies (Germany), AIT, Pfeiffer Vacuum (Germany), SAVVY DATA SYSTEMS SL, Infineon Technologies (Austria) +52 partnersInfineon Technologies (Germany),AIT,Pfeiffer Vacuum (Germany),SAVVY DATA SYSTEMS SL,Infineon Technologies (Austria),Soraluce,University of Groningen,Fabmatics (Germany),SMART CONTROL SYSTEMS AND SOFTWARE JOINT STOCK COMPANY,MULTIVERSE COMPUTING SL,WU,SEMAKU BV,IECS,TÜBİTAK,SYSTEMA,BMW (Germany),UPM,STREAM ANALYSE SWEDEN AB,SKANDINAVISKA ENSKILDA BANKEN AB,RSA FG,Harokopio University,Husqvarna (Sweden),TU/e,University of Lübeck,UNIVERSITY OF APPLIED SCIENCES,Gdańsk University of Technology,AI DIGI+ SOLUTIONS GMBH,BUTE,GOIMEK,University of Hagen,IPH,CETTO KUNSTSTOFFVERARBEITUNG GMBH,ZELOSPLANT INDOOR SOLUTIONS GMBH,THALES,Ibermática (Spain),PCL,LFOUNDRY SRL,IFD,FHG,Luleå University of Technology,AITIA International Zrt.,TUD,Latvian Academy of Sciences,Zittau/Görlitz University of Applied Sciences,Pfeiffer Vacuum (France),STATWOLF DATA SCIENCE,KAI,TTTECH INDUSTRIAL AUTOMATION AG,Signify Netherlands BV,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLAS,IDEKO,VIF,NXP (Netherlands),UNIPD,DAC.DIGITAL JOINT-STOCK COMPANY,CISC Semiconductor (Austria),BMW Group (Germany)Funder: European Commission Project Code: 101112089Overall Budget: 70,423,600 EURFunder Contribution: 17,777,800 EURAIMS5.0, a collaborative Innovation Action aims at strengthening European digital sovereignty in comprehensively sustainable production, by adopting, extending and implementing AI-enabled hardware and software components and systems across the whole industrial value chain to further increase the overall efficiency. Vulnerability of existing supply chains in crisis shows the need for shorter supply chains and for keeping production in Europe. AI enabled fabs will be given more output and higher sustainability, which makes them more competitive on a global scale. New technologies from IoT and based on semantic web ontologies, ML and AI will help to enable the transformation from Industry4.0 to Industry5.0, to create human-centric workplace conditions and to enable the transformation of European industry to climate-friendly production. Above all, sustainability and resilience will be improved. In essence, AIMS5.0 will deliver: - AI-enabled electronic hardware components & systems for sustainable production - AI tools, methods & algorithms for sustainable industrial processes - SoS-based architectures & micro-services for AI-supported sustainable production - Semantic modelling & data integration for an open access productive sustainability platform - Acceptance, trust & ethics for explainable industrial AI leading to human-centered sustainable manufacturing 20 use cases in 9 industrial domains resulting in high TRLs will validate the project’s findings in an interdisciplinary manner. A professional dissemination, communication, exploitation and standardisation will ensure the highest impact possible. For the first time a joint approach for implementing AI and AI-enabled hardware will be developed that overarches different industrial domains. AIMS5.0 will result in lower manufacturing costs, increased product quality through AI-enabled innovation, decreased time-to-market and increased user acceptance of versatile technology offerings. They will foster a sustainable development, in an economical, ecological and societal sense and act as enablers for the Green Deal and push the industry towards Industry5.0. The innovations will leverage the experience of the 53 partners, such as renowned OEMs, Tier-1 and Tier-2 suppliers, technology and application large enterprises and SMEs, supported by academic research specialists in fields like AI, industrial hard-ware and software, decision making and management algorithms. Specific outcomes of the project are - 20% faster time to market, - Participation of disabled people in the factory environment > 5% (in relation to the total number of employees employed in production), - AI based MES capability > 10 %, - Increased user awareness and trust by 10%, - Subsequent reduction of environmental footprint for wafer transport, handling and storage > 20 %, - 50% reduction of time for monitoring industrial equipment. AIMS5.0 is a pan-European initiative to boost industrial competitiveness through interdisciplinary innovations, establishing sustainable ECS value chains and therefore contribute to European Digital Sovereignty addressing urgent issues like Security of Supply, Monitoring and Crisis Response, and Chip Shortage.
more_vert Open Access Mandate for Publications assignment_turned_in Project2016 - 2019Partners:Siemens (Germany), SAL, Dr. Födisch Umweltmesstechnik AG, IXION INDUSTRY AND AEROSPACE SL, INTEGRASYS +30 partnersSiemens (Germany),SAL,Dr. Födisch Umweltmesstechnik AG,IXION INDUSTRY AND AEROSPACE SL,INTEGRASYS,TECNALIA,TAS-E,Powertec (Slovakia),MCL,CTR,XENON AUTOMATISIERUNGSTECHNIK GMBH,Graz University of Technology,CTTC,AAU,TUD,AIT,IQUADRAT,IMEC,HOCHSCHULE FUR ANGEWANDTE WISSENSCHAFTEN BURGENLAND GMBH,APC,IFD,ANDRITZ AG,VIF,CSIC,Signify Netherlands BV,Infineon Technologies (Austria),Ams AG,IMA,BTE,TU Delft,Infineon Technologies (Germany),FHG,Institució dels Centres de Recerca de Catalunya,AMS NETHERLANDS B.V.,STUFunder: European Commission Project Code: 692480Overall Budget: 64,238,000 EURFunder Contribution: 14,483,000 EURThe EU has set the stage to empower semiconductor manufacturing in Europe being one of the key drivers for innovation and employment and creator for answers to the challenges of the modern society. Aim of IoSense is to boost the European competitiveness of ECS industries by increasing the pilot production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establishing three fully connected semiconductor pilot lines in Europe: two 200mm frontend (Dresden and Regensburg) and one backend (Regensburg) lines networking with existing highly specialized manufacturing lines. Focus is the availability of top innovative, competitive sensors and sensor systems “Made in Europe” for applications in Smart Mobility, Society, Energy, Health and Production. Today competitors are already involved in the development of sensor systems for applications in the emerging “Internet of Things”. But there is a significant gap between those forces and the capabilities to bring ideas into the high volume market fast enough. IoSense will close this gap by providing three modular flexible pilot lines being seamless integrated in the IoT value crating networks and ready to manufacture each kind of sensor system prototypes. IoSense will increase the manufacturing capacity of sensor/MEMS components in the involved pilot lines by factor of 10 while reducing manufacturing cost and time by 30%. IoSense is designed to enable focused development work on technological and application oriented tasks combining with market orientation. “Design to Market Needs” will be accomplished by customer involvement, embedding all required functionality besides sensors. Finally, the time for idea-to-market for new sensor systems is intended to be brought down to less than one year. As a result, semiconductor manufacturing will get a new boost in Europe enabling the industry with competitive solutions, securing employment and providing answers to the upcoming challenges in the IoT era.
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