The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilot line between 2 companies: - Soitec for the fabrication of advanced engineered substrates (UTBB: Ultra Thin Body and BOx (buried oxide)) without and with strained silicon top film. - STMicroelectronics for the development and industrialization of state of the art FDSOI technology platform at 14nm and beyond with an industry competitive Power-Performance-Area-Cost (PPAC) trade-off. The project represents the first phase of a 2 phase program aiming at establishing a 10nm FDSOI technology for 2018-19. A strong added value network is created across this project to enhance a competitive European value chain on a European breakthrough and prepare next big wave of electronic devices. The consortium gathers a large group of partners: academics/institutes, equipment and substrate providers, semiconductor companies, a foundry, EDA providers, IP providers, fabless design houses, and a system manufacturer. E&M will contribute to the objective of installing a pilot line capable of manufacturing both advanced SOI substrates and FDSOI CMOS integrated circuits at 14nm and beyond. Design houses and electronics system manufacturer will provide demonstrator and enabling IP, to spread the FDSOI technology and establish it as a standard in term of leading edge energy efficient CMOS technology for a wide range of applications battery operated (consumer , healthcare, Internet of things) or not. Close collaboration between the design activities and the technology definition will tailor the PPAC trade-off of the next generation of technology to the applications needs.

Functional performances of nano-materials and thin films with nano-scale thickness are determined not only by material selection but also by their nano-physical dimensions, nano-scale structure and their nano-scale chemical composition. Precise characterisation of these properties is critical to develop new functional nano-materials and optimise processes toward higher performance, improved reproducibility and yield and up-scaling to larger quantities. X-ray characterisation techniques such as X-ray diffraction analysis (XRD) or X-ray reflectometry (XRR) are widely used in research laboratories for this task but are rarely used in industrial material development and assessment of production processes due to technical limitations and required high level expertise. The project NanoQI targets the development of an industry-suited, real-time and in-line capable technique to characterise nano-structure and nano-dimensions of (thin-film) nano-materials by optimisation of area-detector based XRR and XRD concepts and their multi-modal combination with a novel wide-angle hyper-spectral imaging (HSI) technique. Therewith, NanoQI will provide industry access to real time evaluation of nano-material geometry, structure and morphology and correlative imaging of deviations of these properties. NanoQI technology will be demonstrated in three relevant industrial application scenarios: in-situ process assessment in manufacturing of perovskite solar cells; large-area vacuum roll-to-roll coating of polymer webs and industrial atomic layer deposition of dielectric and gas barrier layers.