Opto-electronic devices are opening exciting new applications everyday. With new display options using pliable substrates such as plastic and flexible glass, OLEDs manufacturers are bringing a wide range of new applications in lighting (e.g. energy efficient lighting) and different type of displays. Similarly, with the emergence of thin-film technologies in the solar cells market, new applications ranging from installations on curved surfaces to building-integrated PV has become possible. However, to meet the industry requirements for mass production, including low cost, manufacturing volumes and efficiency, many challenges still need to be addressed. These challenges for OPV, OLED and CIGs are scale-up from laboratory to mass production, selection of efficient manufacturing processes, employing inspection, control and measurement techniques to improve yield, quality and time-to-market. OLEDSOLAR aims to tackle these challenges by developinginnovative manufacturing processes for critical steps in the production of opto-electronic devices including OLEDs, OPVs and CIGs solar cells. The proposed activities include reconfigurable high yield (>10% improvement) processes to be scaled up, tested at pilot lines and implemented in production line for validation. A complete system of inspection, quality control, functional testing and measurements using advance system and sensors will be optimised in the project for efficient manufacturing of opto-electronics parts. Recycling and re-use strategies will be developed allowing resource efficiency and reduction of high value product wastes. Automation and advance processing software will be developed for overall control and monitoring of roll-to-roll (R2R) and sheet-to-sheet (S2S) manufacturing process. During 36 months, a multidisciplinary team of leading RTOs and industries in this field will dedicate their resources and effort to perform proposed activities in 8 WPs and guarantee the maximum impact of OLEDSOLAR project.

The objectives in Power2Power aim to foster a holistic, digitized pilot line approach by accelerating the transition of ideas to innovations in the Power Electronic Components and Systems domain. In the course of this project, the international leadership of the European industry in this segment will be strengthened by means of a digitized pilot line approach along the supply chain located entirely in Europe; working together with multiple organizations, combining different disciplines and knowledge areas in the heterogeneous power-ECS environment. Only these comprehensive efforts will allow reaching a high-volume production of smart power electronics to change the market towards energy-efficient applications to meet the carbon dioxide reduction goals of the European Union. Consequently, economic growth and Tackling grand societal challenges “Energy” and “Mobility” lead to safeguarding meaningful jobs for European citizens. Silicon-based power solutions will outperform new materials (SiC, GaN) for many more years in terms of cost-to-performance-ratio and reliability. Thus, the Silicon-based power solutions will keep innovating and growing the upcoming years. On a long run the project Power2Power will significantly impact the path to the industrial ambition of value creation by digitizing manufacturing and development in Europe. It fully supports this vision by addressing key topics of both pillars “Key Applications” and “Essential Capabilities”. By positioning Power2Power as innovation action, a clear focus on exploitation of the expected result is a primary goal. Smart energy utilization with highly efficient power semiconductor-based electronics is key in carefully utilizing the scarce resources. Energy generation, energy conversion and smart actors are these application domains where advanced high voltage power semiconductor components primarily impact the path toward winning innovations.

The SILENSE project will focus on using smart acoustic technologies and ultrasound in particular for Human Machine- and Machine to Machine Interfaces. Acoustic technologies have the main advantage of a much simpler, smaller, cheaper and easier to integrate transducer. The ambition of this project is to develop and improve acoustic technologies beyond state-of-the-art and extend its application beyond the mobile domain to Smart Home & Buildings and Automotive domains. In this project, it will be proven that acoustics can be used as a touchless activation and control mechanism, by improvement or development of different smart acoustic technology blocks (hardware, software and system level) and integrate these blocks at system level. At technology level, the SILENSE project will: - Adapt and improve cost, performance, directivity and power consumption of (MEMS) acoustic transducers (incl. testing and qualification) - Heterogeneously integrate arrays of acoustic transducers with other electronics, using advanced (3D) packaging concepts - Develop smart algorithms for acoustical sensing, localization and communication - Combine voice and gesture control by means of the same transducer(s) At application level the SILENSE project will: - Apply acoustical sensing for touchless activation/control of mobile devices, wearables and, more in general, IoT nodes. The project links to Smart Systems Integration (B4), and refers also to application application-related topics, such as Smart Mobility and Smart Society. The application scope of the developed technologies is broader and comprises more societal domains, such as smart home/buildings, smart factories (i.e. Smart Production) and even Smart Health. Furthermore, a clear cross reference with Semiconductor Process, Equipment and Materials (B1) is established in view of the heterogeneous integration of technology blocks. Conventional silicon technologies will be combined with printed (flexible, large area electronics).

The EU has set the stage to empower semiconductor manufacturing in Europe being one of the key drivers for innovation and employment and creator for answers to the challenges of the modern society. Aim of IoSense is to boost the European competitiveness of ECS industries by increasing the pilot production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establishing three fully connected semiconductor pilot lines in Europe: two 200mm frontend (Dresden and Regensburg) and one backend (Regensburg) lines networking with existing highly specialized manufacturing lines. Focus is the availability of top innovative, competitive sensors and sensor systems “Made in Europe” for applications in Smart Mobility, Society, Energy, Health and Production. Today competitors are already involved in the development of sensor systems for applications in the emerging “Internet of Things”. But there is a significant gap between those forces and the capabilities to bring ideas into the high volume market fast enough. IoSense will close this gap by providing three modular flexible pilot lines being seamless integrated in the IoT value crating networks and ready to manufacture each kind of sensor system prototypes. IoSense will increase the manufacturing capacity of sensor/MEMS components in the involved pilot lines by factor of 10 while reducing manufacturing cost and time by 30%. IoSense is designed to enable focused development work on technological and application oriented tasks combining with market orientation. “Design to Market Needs” will be accomplished by customer involvement, embedding all required functionality besides sensors. Finally, the time for idea-to-market for new sensor systems is intended to be brought down to less than one year. As a result, semiconductor manufacturing will get a new boost in Europe enabling the industry with competitive solutions, securing employment and providing answers to the upcoming challenges in the IoT era.