This project will research new technologies for CMOS image sensors that are needed in the next generation of several application domains. The image sensor research will focus on enhancing the capabilities of current imaging devices: • New design (architectures) and technology (e.g. 3D stacking) for better pixels (lower noise, higher dynamic range, new functionality within the pixel) and more pixels (higher spatial and temporal resolutions) at higher speed, time-of-flight pixels, local (on-chip) image processing, embedded CCD in CMOS TDI pixels. • Extended sensitivity and functionality of the pixels: extension into infrared, filters for hyper-and multi-spectral imaging, better colour filters, programmable filters with LCD cells. Application domains that will be covered are: • Digital Lifestyle: Broadcast, Digital Cinema & Entertainment, Smart home (Grass Valley, Angenieux, Silios, Delft University of Technology, SoftKinetic) • Smart Production (IMEC, C-cam) • High-end Security (Adimec, Angenieux, Le2i, TNO) • Agriculture and food sorting using hyper- and multi-spectral imaging and programmable filters (Silios, Le2i) • Medical healthcare: diagnostics using multi-/hyper-spectral imaging and programmable filters (Adimec, TNO, Silios, Quest and Focal) • Gas detection using multi spectral IR imagers (Sofradir) • Security: gas sensing (Sofradir) The prototype CMOS image sensors for several application domains will be demonstrated together with the sensor related processing.

Large infrared (IR) imagers in the NIR to VLWIR wavelength ranges are critical requirements for Earth observation, and Science and Astronomy missions. They provide information not available in the visible wavelength range like, for example, object temperature or chemical composition. The technology available in Europe today allows for detectors with around 1 Mega pixel to be manufactured. It is not able to produce the 4 Megapixel detectors necessary for future missions. Europe needs to become non-dependent for the procurement of these types of detectors. It is the goal of ASTEROID to develop the technology that will make Europe non-dependent for large IR detectors. The technology to be developed is based on HgCdTe detection layers grown on CdZnTe substrates and on large dimensions Si Read Out Integrated Circuits (ROIC). By adjusting its composition, the use of HgCdTe detection layers makes it possible to address all the wavelengths required, from visible to VLWIR wavelengths. ASTEROID will use the contributions from 6 partners in 5 different fields to develop the building blocks for large IR detectors: • ROIC processing: EVG and Sofradir • HgCdTe and CdZnTe processing: CEA-LETI and Sofradir • Hybridization of the ROIC and detection layers: Sofradir • Thermo-Mechanical Modeling: ADDL • Electro-optic and connectivity characterization: IFAE and CEA-IRFU

New strategic and growing markets related to connectivity, mobility, automotive, health and earth monitoring call for improved imaging solutions in visible, LWIR and VLWIR offering advanced functionalities and cost effectiveness. Visible imagers market is currently largely dominated by non-European countries. LWIR µbolometers imagers, fabricated above-IC, have not yet been democratized for high volume markets due to the difficulty to solve performance versus cost equation. However, Asian providers are making important progress to tackle this challenge. ATHENA aims at strengthening European economy in high-tech imaging technologies: - by taking advantage of 3D stacking technologies, improved sensor-processing integration, multimodal 2D/3D functionalities - by preparing the manufacturing of µbolometers from 200mm to 300mm CMOS wafers for productivity gain and access to more advanced CMOS nodes for improved functionalities, developing cost effective LWIR wafer level optic solutions - by using new methods of growing and doping materials for future VLWIR imager manufacturability. This will foster new applications related to automated systems (in industry, border and security management), health and consumer markets, and earth & climate monitoring. ATHENA gathers a strong European consortium composed of highly renowned Research Technological Organizations, big industrial players in imaging technologies and end-users to specify, design, develop, test these technologies in use cases and set common specifications for the imagers to support their industrialization and widespread adoption. In line with both the European Union’s Chips Act and the Electronics, Components and Systems Strategic Research and Innovation Agenda, ATHENA will not only address the development of new sensors and chips, but also their integration in larger systems to pave the way to promising applications. ATHENA will strongly contribute to Europe leadership, industrial competitiveness and sovereignty.

Micro-bolometer sensors are compact, light, low power, reliable and affordable infrared imaging components. They are ahead of the cooled infrared sensors for these criteria but lag behind them in terms of performance: - Existing micro-bolometer technologies have thermal time constants around 10 msec. This is more than 10 times that of cooled detectors. - Moreover, there is no multispectral micro-bolometer sensor available today for applications such as absolute thermography and optical gas imaging. BRIGHTER will develop 2 new classes of micro-bolometer solutions to reduce the performance gap with their cooled counterparts: - Fast thermal micro-bolometer imaging solutions with time constant in the 2.5 to 5 msec range, that is to say 2 to 4 times faster than that of today’s micro-bolometer technologies. Read out integrated circuits able to operate up to 500 frames per seconds will also be investigated. - Multi-spectral micro-bolometer solutions with at least access at the pixel level to 2 different wavelengths in the range 7 to 12 µm. The developments will focus on pixel technology, Read Out Integrated Circuit, low power edge image signal processing electronic, optics, and image treatment algorithms. All stakeholders of the value chain are involved: academics, RTO, micro-bolometer manufacturer, algorithm developers, camera integrators and end users. They will collaborate to define the best trade-offs for all use-cases. The 2 new classes of products that will spring from BRIGHTER will generate concrete benefits. They will make it possible to save on material and energy in the manufacturing sector, perform efficient and affordable monitoring of infrastructures and trains, contribute to autonomous vehicles sensor suite, decrease the road casualties among Vulnerable Road Users, better control gas emission in cities and industrial areas. These new usages served by the European industry will allow Europe to increase its market share in the infrared imaging industry.

The new ways of driving and use a vehicle as expected in the scope of Smart Mobility asks for reliable and affordable versatile perception systems. Perception systems need to be accurate and reliable both for what happen in the cabin and out of the cabin. The driver and passenger monitoring needs to be improved as well as the environment surrounding monitoring, in all light and weather conditions. For both of these topics, the extension of current perception systems (mainly based on visible imaging, LIDAR and RADAR detection) to the thermal sensing is a must. Thermal sensing, especially in the LWIR (= 6 to 14 µm) bandwidth, provides valuable additional information and has to be considered as a must for the next generation of L4 (‘’Eyes off’’) and L5 (‘’Mind off’’) autonomous driving. In this context, the HELIAUS project aims to deliver breakthrough perception systems for in-cabin passengers monitoring, as well as for the car surrounding by developing smart thermal perception systems that extend the current systems to the LWIR bandwidth. From general point of view, the main objectives of the HELIAUS project and work to be carried out are as follows: 1/ to develop cutting-edge and cost effective technologies leading to low cost, high performance LWIR module, 2/ to specify, develop, test and validate the thermal perception systems first prototypes for in-cabin and out-of cabin application, 3/ to quantify the valuable addition of the thermal sensing into the current systems and future systems, 4/ to promote the benefit of such systems in the future autonomous vehicles, in particular, and for smart mobility in general. The HELIAUS project is a first and essential step to the creation of a future industrialized affordable thermal perception systems offer. Being a part of the IPCEI Microelectronics, in which ULIS leads a project in the framework of the ‘’Smart Sensors’’, the HELIAUS project will positively contribute to the global competitiveness of the European industry.