
NXP Semiconductors
NXP Semiconductors
7 Projects, page 1 of 2
assignment_turned_in Project2014 - 2017Partners:FAGOR ELECTRONICA, S. COOP., ISEP, Centria University of Applied Sciences, VIF, Indra (Spain) +56 partnersFAGOR ELECTRONICA, S. COOP.,ISEP,Centria University of Applied Sciences,VIF,Indra (Spain),PHILIPS ELECTRONICS NEDERLAND B.V.,TECNALIA,SOFTEC INTERNET SL,L&T,EpiSensor Ltd,TAS-E,ITI,HI Iberia (Spain),SpaceForest,MGEP,Gdańsk University of Technology,IMEC-NL,Adevice,NXP (Netherlands),Polytechnic Institute of Porto,Graz University of Technology,ETIC,OUMAN,DANA BELGIUM,VOLVO TECHNOLOGY AB,CEA,TU/e,FTW,AAU,FMTC,Inabensa,GMVIS SKYSOFT,NXP Semiconductors,IECS,Signify Netherlands BV,SISW,SIGARDEN SA,RTE,CIT,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,MUG,IK4-TEKNIKER,SIS,IMCS,VEMCO SP ZOO,IMINDS,CMT,IMEC,MONDRAGON CORPORACION COOPERATIVA SCOOP,DANA BELGIUM,INTEGRASYS,SIRRIS,ACCIONA,Thalgo (France),VPS,Halmstad University,AVL,Latvian Academy of Sciences,AIRBUS DS SAS,Gibson Innovations (Belgium),VALEO ISCFunder: European Commission Project Code: 621353more_vert assignment_turned_in Project2012 - 2014Partners:OPTISORT, STENA TECHNOWORLD AB, NXP Semiconductors, BARCO NV, MOS +10 partnersOPTISORT,STENA TECHNOWORLD AB,NXP Semiconductors,BARCO NV,MOS,Signify Netherlands BV,MARAS,PHILIPS ELECTRONICS NEDERLAND B.V.,PHILIPS INNOVATIVE APPLICATIONS NV,Connectronics,divisionofConnectrGroup NV,CIT Recycling Development AB,TU Delft,IMEC,MAT-TECH,TNOFunder: European Commission Project Code: 296127more_vert Open Access Mandate for Publications and Research data assignment_turned_in Project2021 - 2024Partners:KUL, Telefonica Research and Development, NXP Semiconductors, Graz University of Technology, BLOOLOC +6 partnersKUL,Telefonica Research and Development,NXP Semiconductors,Graz University of Technology,BLOOLOC,LiU,NXP SEMICONDUCTORS AUSTRIA GMBH & CO KG,EAB,Lund University,TELEFONICA SA,Technikon (Austria)Funder: European Commission Project Code: 101013425Overall Budget: 4,644,460 EURFunder Contribution: 4,644,460 EURThe REINDEER project will develop a new smart connect-compute platform with a capacity that is scalable to quasi-infinite, and that offers perceived zero latency and interaction with an extremely high number of embedded devices. It will thereto develop “RadioWeaves” technology, a new wireless access infrastructure consisting of a fabric of distributed radio, computing, and storage resources. RadioWeaves can be deployed as panels mounted on walls and ceilings. It brings a large number of antennas and intelligence close to devices offering consistently excellent service at minimal transmit power and making very efficient usage of network bandwidth and energy. Technologically, RadioWeaves advance the ideas of large-scale intelligent surfaces and cell-free wireless access, two theoretical concepts that bear great promise to offer capabilities far beyond 5G networks. We will characterize channels based on measurements and develop distributed platform architectures to realize the great potential in actual deployments. We will develop protocols and algorithms to establish novel resilient interactive applications that require ‘real-time’ and ‘real-space’ cooperation, for future robotized industrial environments, immersive entertainment, and intuitive care, We will co-design focusing algorithms and protocols for enhanced interaction with many energy-neutral devices. REINDEER will provide experimental proof-of-concept in versatile testbeds. Industrial partners fostering innovation team up with academic experts in the REINDEER consortium. The project will reinforce the technological leadership in Europe and create new business opportunities in beyond 5G infrastructure and network operation both licensed and unlicensed bands, the focused vertical domains, and in private networks. We will execute an ambitious communication plan towards industry, pre-standardisation, and a broad public, disseminate through high-impact publications, and organize topical trainings.
more_vert assignment_turned_in Project2014 - 2017Partners:Lantiq A, STU, WHZ, SGS Institut Fresenius GmbH, NXP (Netherlands) +21 partnersLantiq A,STU,WHZ,SGS Institut Fresenius GmbH,NXP (Netherlands),OSRAM GMBH,HSEB DRESDEN GMBH,TUW,Siemens (Germany),Infineon Technologies Romania and CO. Societate in Comandita Simpla,Ams AG,SPTS Technologies (United Kingdom),Infineon Technologies (Austria),NXP Semiconductors,PCCL,Robert Bosch (Germany),IFKL,IMEC-NL,Joanneum Research,University of Innsbruck,Infineon Technologies (Germany),CISC Semiconductor (Austria),MCL,IFD,SYSTEMA,TUDFunder: European Commission Project Code: 621270more_vert Open Access Mandate for Publications assignment_turned_in Project2017 - 2020Partners:Oslo Metropolitan University, Klas Telecom, EYE NETWORKS AS, Graz University of Technology, TELENOR ASA +56 partnersOslo Metropolitan University,Klas Telecom,EYE NETWORKS AS,Graz University of Technology,TELENOR ASA,Halmstad University,NXP SEMICONDUCTORS AUSTRIA GMBH & CO KG,AIT,GMVIS SKYSOFT,MUG,EMBRAER,ACCIONA CONSTRUCCION SA,EAB,WOLFFIA AS,TU/e,Indra (Spain),AVL,XETAL,MGEP,Gdańsk University of Technology,FEV EUROPE GMBH,VIF,RISE,NSNFINLAND,VEMCO SP ZOO,NXP Semiconductors,Signify Netherlands BV,UCC,UiO,Polytechnic Institute of Porto,RTE,PHILIPS ELECTRONICS NEDERLAND B.V.,TECNALIA,SICS,FSC,IK4-TEKNIKER,LCM,IMEC-NL,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,ISEP,TYCO IRELAND LIMITED,SBA,Centria University of Applied Sciences,INTEGRASYS,CIT,Movation (Norway),Robert Bosch (Germany),QPLOX ENGINEERING,JIG.ES,FEV POLSKA SPOLKA Z OGRANICZONA ODPOWIEDZIALNOSCIA,NXP (Netherlands),CISC Semiconductor (Austria),SMART INNOVATION OSTFOLD AS,SIEMENS,TELLU AS,UPM,SIEMENS MOBILITY AUSTRIA GMBH,ITI,TU Delft,RD VELHO,KTHFunder: European Commission Project Code: 737422Overall Budget: 38,792,400 EURFunder Contribution: 10,228,000 EURCreating trust in wireless solutions and increasing social acceptance are major challenges to achieve the full potential of the Internet of Things. SCOTT, with 57 key partners from 12 countries (EU + Brazil), will provide efficient solutions of wireless, end-to-end secure, trustworthy connectivity and interoperability to bridge the last mile to the market (TRL 6-7). SCOTT focusses on wireless sensor & actuator networks and communication in mobility, smart infrastructure and health, thus addressing essential European societal challenges and significantly contributing to burning issues such as Automated Vehicles or Industry 4.0. SCOTT is based on 15 industrial use cases with a focus on cross-domain applications and heterogeneous environments, emphasizing 5G and cloud computing aspects. It uses a standardized multi-domain reference architecture, fully compliant with ISO 29182, which fosters reusability, scalability, and interoperability. Nearly 50 reusable technical building blocks will be developed and utilized, proving cross-domain sharing of trustable wireless technologies and services. Finally, more than 20 tangible demonstrators will be presented all over Europe to a broader public. Following a user-centred design to put security and privacy really in the hands of the user, SCOTT will build up and apply a dedicated Trusted System Development Framework to significantly foster acceptance of SCOTT solutions on the market, including the creation of an unprecedented, standardisable ‘privacy labelling’. SCOTT covers full value chains from silicon to end-users/operators showing full vertical integration. Via reference implementations and open innovation approaches as well as close cooperation with AIOTI and other cluster organizations, SCOTT will establish an attractive, long-term eco-system. Ultimately, SCOTT will foster Europe’s independence for security enabling components and systems and will further boost the growing “internet economy”.
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