MOSAIC addresses a grand challenge for European competitiveness: technological independence and filled fabs in the landscape of automated systems. By fostering innovation in Electronic Components and Systems (ECS), MOSAIC aims to propel Europe to excellence and digital autonomy, directly linked to the EU Chips Act. The project achieves this through a comprehensive strategy. It will develop next-generation ECS offering superior, cognitive system intelligence, enabling energy efficiency and robustness. These results will be tailored to the demands of automated systems, enabling rapid data processing and intuitive, AI-enabled decision- making. MOSAIC tackles the challenge of integrating diverse perception hardware configurations, ensuring that automated systems can perceive their surroundings in a non-invasive manner, avoiding a single point of failure, with unparalleled accuracy and decreased complexity. Additionally, the project emphasizes standardized communication protocols and interoperability, fostering a collaborative ecosystem across several industries, namely automotive, aerospace, maritime, industrial automation and infrastructures. By spearheading such advancements, MOSAIC empowers European ECS manufacturers to gain a competitive advantage. The project's achievements will be demonstrated in 31 cutting-edge technical showcases, indicatively global perception through 360° distributed radar, AI-enabled reasoning through magnetic field signature and resilient communications by means of non-terrestrial networks. 2 accompanying impact studies, will solidify Europe's position as a global leader in automated systems. MOSAIC leverages a pan-European consortium encompassing the entire ECS value chain, ensuring a comprehensive effort towards filling the European fabs and ensuring digital sovereignty. In essence, MOSAIC is an investment in Europe's future – a secure digital future of technological leadership, economic prosperity, and strategic independence.

The challenges and major HiCONNECTS objectives are to transform the centralized cloud platform to decentralized platforms which include edge cloud computing in a sustainable, energy-efficient way. This will bring cloud services including Artificial Intelligence (AI) closer to the IOT end-users, which enables them to really use the COT and IOT efficiently. The technologies underpinning this revolutionary step include the development of high-performance computing, storage infrastructure, network interfaces and connecting media , and the analysis of IOT sensors and big data in real-time. This major step forward will enable, for example, the mobile clients (during the 5G deployment phase and 6G exploration) to move among different places with minimum cost, short response time and with stable connection between cloud nodes and mobile devices. The main underlying technology to be developed by the HiCONNECTS consortium, comprising large industrial players, universities and RTO’s, and many SMEs, can be summarized under the title: ’heterogenous integration’ (HI) which is needed to meet the computing power, bandwidth, latency and sensing requirements for the next generation cloud and edge computing and applications. The HI revolution brings the electronic components and systems (ECS) into a new domain, which combines traditional silicon wafers integrated circuit (IC), InP based high speed electronics , and Si and InP photonics devices and interconnect. The HiCONNECTS ambition is to demonstrate, through HI development, a leap in computing and networking reliability and performances across the full vertical and horizontal ECS value chain (i.e. essential capabilities and key applications) in a sustainable way. In addition, HiCONNECTS will focus on the development of next generation design, algorithms, equipment (HW/SW), systems and Systems of Systems (SOS).