ASICx2 will deliver a state-of-the-art Edge-AI computer vision fabric integrated with a software-defined ISP (image signal processor) in a silicon chiplet package. This innovation provides a universal solution for low-power processing of raw data from diverse imaging sensors (RGB, NIR, thermal, neuromorphic) combined with Edge-AI inference for smart-camera functions, offering the potential for built-in GDPR compliance at the silicon level. The proposal builds on IP-core solutions that currently embedded into market-leading consumer imaging products including action-cameras and professional DSLR cameras. The Edge-AI hardware architecture and other key elements of the ISP are covered by 6 fundamental patent families. ASICx2 targets a diverse range of high-growth and emerging markets, including IoT, automotive, surveillance, and consumer electronics. The Edge AI market is projected to reach $60 billion by 2030 and presents significant opportunities for a scalable, privacy-centric, and energy-efficient imaging/sensing solution as provided by ASICx2. Additional niche markets for ASICx2 include smart glasses (€30B), fleet monitoring (€10B), home security (€15B), smart cameras in building management and smart-city (20B+) and, agricultural IoT (8B). These provide opportunities for strategic partnerships and commercialization of the technology in the period 2026-2028. While there are many positive indicators linked to this proposal it is still high-risk, both from a technology and market perspective due to (i) technological complexity and novelty, (ii) high initial capital requirements for Engineering NRE, (iii) market entry challenges and (iv) lack of immediate ROI for conventional investors. Finally, this proposal is well-aligned with European strategic goals, such as achieving technological sovereignty in AI hardware and advancing innovation based on low-power Edge-AI inference technology.

New strategic and growing markets related to connectivity, mobility, automotive, health and earth monitoring call for improved imaging solutions in visible, LWIR and VLWIR offering advanced functionalities and cost effectiveness. Visible imagers market is currently largely dominated by non-European countries. LWIR µbolometers imagers, fabricated above-IC, have not yet been democratized for high volume markets due to the difficulty to solve performance versus cost equation. However, Asian providers are making important progress to tackle this challenge. ATHENA aims at strengthening European economy in high-tech imaging technologies: - by taking advantage of 3D stacking technologies, improved sensor-processing integration, multimodal 2D/3D functionalities - by preparing the manufacturing of µbolometers from 200mm to 300mm CMOS wafers for productivity gain and access to more advanced CMOS nodes for improved functionalities, developing cost effective LWIR wafer level optic solutions - by using new methods of growing and doping materials for future VLWIR imager manufacturability. This will foster new applications related to automated systems (in industry, border and security management), health and consumer markets, and earth & climate monitoring. ATHENA gathers a strong European consortium composed of highly renowned Research Technological Organizations, big industrial players in imaging technologies and end-users to specify, design, develop, test these technologies in use cases and set common specifications for the imagers to support their industrialization and widespread adoption. In line with both the European Union’s Chips Act and the Electronics, Components and Systems Strategic Research and Innovation Agenda, ATHENA will not only address the development of new sensors and chips, but also their integration in larger systems to pave the way to promising applications. ATHENA will strongly contribute to Europe leadership, industrial competitiveness and sovereignty.