
PREMO SL
PREMO SL
3 Projects, page 1 of 1
Open Access Mandate for Publications and Research data assignment_turned_in Project2020 - 2025Partners:CARTIF, PREMO SL, Efacec Energia, IEIT, CEA +11 partnersCARTIF,PREMO SL,Efacec Energia,IEIT,CEA,RINA-C,PREMO S.A.U.,METROPOLITEN JSC,AKUO ENERGY SAS,CIRCE,UBITECH ENERGY,CIEMAT,HYPERTECH AE,TUAS,ICONS,CERTHFunder: European Commission Project Code: 957769Overall Budget: 7,616,520 EURFunder Contribution: 6,957,200 EURDC grids attractiveness has been increased in the last years due to the high proliferation of renewable energy sources together with the increase in DC loads (electronics, LED lighting, electric vehicles, energy storage…). The main drivers behind this paradigm shift are related to the improved efficiency, flexibility, security and reliability DC grids may provide, thus increasing the sustainability of the energy distribution system. However, there is a need for demonstration of DC technologies and grid topologies so that these solutions are able to evolve from a promising solution for the future smart grids to a commercially available technological option. Under this context, TIGON aims to achieve a smooth deployment and integration of intelligent DC-based grid architectures within the current energy system while providing ancillary services to the main network. To do so, TIGON proposes a four-level approach aiming at improving 1) Reliability, 2) Resilience 3) Performance, and 4) Cost Efficiency of hybrid grids through the development of an innovative portfolio of power electronic solutions and software systems and tools focused on the efficient monitoring, control and management of DC grids. These solutions will be demonstrated in two main Demo-Sites located in France and Spain, while additional use cases in the residential and urban railway sectors will act as niche markets for analysing and further solidifying the replication of TIGON developments after the project’s end. TIGON has involved for this purpose a multidisciplinary team of 15 partners from 8 different European Member States with a well-balanced consortium integrated by 7 non-profit entities and 7 companies. This partnership provides the required expertise from fields such as power electronics, cybersecurity, standardisation, etc. to design the solutions proposed within TIGON as well as the industrial capabilities required for the manufacturing, integration and validation of the whole TIGON concept.
more_vert Open Access Mandate for Publications assignment_turned_in Project2021 - 2024Partners:DANFOSS SILICON POWER GMBH, NANO-JOIN GMBH, ISLE Steuerungstechnik und Leistungselektronik GmbH, CEA, University of Seville +32 partnersDANFOSS SILICON POWER GMBH,NANO-JOIN GMBH,ISLE Steuerungstechnik und Leistungselektronik GmbH,CEA,University of Seville,VSCM,LASERTEC USA INC,Mersen (France),PREMO S.A.U.,IUNET,VUT,Semikron (Germany),SOITEC LAB,SOITEC,PREMO SL,TPLUS ENGINEERING GMBH,EVG,AIXTRON SE,SURAGUS (Germany),Chemnitz University of Technology,HPE,LiU,IMA,FHG,STMICROELECTRONICS SILICON CARBIDE AB,SAINT-GOBAIN INDUSTRIEKERAMIK RODENTAL GMBH,Robert Bosch (Germany),VALEO E AUTOMOTIVE FRANCE SAS,SAINT-GOBAIN CREE,NOVASiC (France),STMicroelectronics (Switzerland),FORSCHUNGS- UND ENTWICKLUNGSZENTRUM FACHHOCHSCHULE KIEL GMBH,École Centrale de Lille,Hamm-Lippstadt University of Applied Sciences,APPLIED MATERIALS FRANCE,RHEINLAND-PFALZISCHE TECHNISCHE UNIVERSITAT,CENTROTHERM INTERNATIONAL AGFunder: European Commission Project Code: 101007237Overall Budget: 89,021,400 EURFunder Contribution: 20,564,300 EURSilicon Carbide based power electronics use electrical energy significantly more efficient than current silicon-based semiconductors: gains from 6% to 30% are expected depending on application. TRANSFORM will provide European downstream market players with a reliable source of SiC components and systems based on an entirely European value chain - from substrates to energy converters. Its technical excellence strengthens the global competitive position of Europe. TRANSFORM improves current SiC technologies beyond state-of-the-art to serve large emerging markets for electric power conversion in renewable energies, mobility and industry. Substrate manufacturing process innovation will establish a new global standard: smart-cut technology allows high scalability, superior performance and reliability. Substrate and equipment manufacturers plus technology providers cooperate to increase maturity of the new processes from lab demonstration to pilot lines. Device manufacturers develop and tailor processes and device design based on the new substrate process, including adaptation of planarMOS and development of new TrenchMOS technology. Performance and reliability of devices is expected to increase greatly. For exploiting the potential of SiC devices, integration technologies and system design are improved concurrently, including new copper metallization processes for higher reliability and performance, module integration for high reliability and reduction of cost, and dedicated integrated driver technologies to optimize switching modes and parallel operation in high current applications. The project will demonstrate energy savings in applications (DC/AC, DC/DC, AC/DC) in the renewable energy domain, industry and automotive. TRANSFORM contributes to European societal goals and the green economy through significantly increasing energy efficiency by providing a competitive, ready-to-industrialized technology, strengthening Europes technological sovereignty in a critical field.
more_vert Open Access Mandate for Publications and Research data assignment_turned_in Project2023 - 2026Partners:SOITEC, DTI, STMicroelectronics (Switzerland), Grenoble INP - UGA, PREMO SL +43 partnersSOITEC,DTI,STMicroelectronics (Switzerland),Grenoble INP - UGA,PREMO SL,Technical University of Liberec,CSIC,SAL,Robert Bosch (Germany),University of Perugia,Harokopio University,TST,3DS,THALES DIS FRANCE SAS,ATEA SVERIGE AB,SMARTSOL SIA,AVCR,LEONARDO,ARCELIK,SIEC BADAWCZA LUKASIEWICZ - INSTYTUT MIKROELEKTRONIKI I FOTONIKI,SYNANO BV,NEROSUBIANCO SRL,WEEECYCLING,UTIA,D&R,ORBX,Infineon Technologies (Austria),UCL,DIT,Özyeğin University,4MOD TECHNOLOGY,RISE,VITESCO TECHNOLOGIES FRANCE,CEA,Acorde (Spain),Infineon Technologies (Germany),TETRADIS,FHG,IMEC,GET ELECTRONIQUE,LUNA GEBER ENGINEERING SRL,IFEVS,IMA,ST,MELSEN TECH A/S,ANIAH,AT&S (Austria),EcoDataCenterFunder: European Commission Project Code: 101112065Overall Budget: 34,850,800 EURFunder Contribution: 10,270,300 EURMany different environmental impacts arise from electronics, and the handling of electronic waste (e-waste) is rising quickly to the top of the agenda. E-waste is a significant issue for Europe: Improving its management is an explicit goal of the Green Deal objectives and the Circular Economy Action Plan (3.1. Electronics and ICT). However, due to the requirement to involve the whole value chain, from raw material suppliers to consumers, the complex material background and supply chain, as well as the multitude of competing interests, achieving circularity in the electronics industry is challenging. The main aim of the EECONE project is to reduce e-waste on a European scale. To this end, 54 entities (47 partners, 2 associated partners and 5 affiliated entities) from 16 European countries covering different sectors of activity have joined forces to propose practical ways of reducing the volume of e-waste in the EU. Crucially, the entities that make up EECONE represent all parts of the value chain. EECONE’s approach is interdisciplinary, covering the social, economic, technological, and policy aspects. The environmental impact arising from e-waste can thus be reduced by working in three principal areas: a) Increase service lifetime of electronic products by application of ecodesign guidelines for increasing their reliability and their repair rate, thereby reducing the volume of e-waste. Reduction and replacement of materials to decrease the impact of e-waste. b) Improved circularity by reusing, recycling, and waste valorising materials/elements from electronic products. EECONE’s vision is to develop and embed the constraints linked to managing the end-of-life of electronic products from the very beginning – in the development or process design. EECONE is paving the way as a first step toward a zero-waste electronic industry. The “6R concept will fully guide EECONE” (Reduce, Reliability, Repair, Reuse, Refurbish, Recycle). To deploy its ambitious vision, the EECONE project defines four main objectives: a) Define green. Create clear, simple, open tools to define and design ECS for circularity. Generate, for the first time, a clear framework aiding producers to evaluate their choices and pathways to ecodesign, to foster European leadership in the green transition. b) Make green ECS (Electronic Components Systems): Provide innovative techniques for reducing, repairing, reusing, refurbishing, recycling to decrease e-waste and boost circularity in a new generation of electronics. c) Showcase green solutions: Demonstrate innovation potential, usability, and versatility of the green solution along the value chain. d) Building consciousness: Create an ecosystem empowering the 6R ECS generation. EECONE is a major opportunity to create a European ECOsystem for greeN Electronics and to position Europe as a role model for low environmental impact electronics.
more_vert