
IRNOVA
IRNOVA
3 Projects, page 1 of 1
Open Access Mandate for Publications and Research data assignment_turned_in Project2023 - 2027Partners:IRNOVA, FHG, ISAE, AIRBUS DEFENCE AND SPACE SASIRNOVA,FHG,ISAE,AIRBUS DEFENCE AND SPACE SASFunder: European Commission Project Code: 101134959Funder Contribution: 3,058,900 EURIn the last years, Mercury Cadmium Telluride (MCT) IR Focal Plane Arrays (FPAs) have drastically boosted the observational capabilities of space IR payloads. In the US, industrial production of MCT IR FPAs with formats up to 4K×4K pixels is established, while in Europe, initiatives from European Institutions and most advanced EU manufacturers are currently on-going to progress on large format MCT hybrids such as 2kx2k, though the industrial set-up necessary to support operational space programs remains to be elaborated and matured. As instruments designers are asking for larger size FPAs, EU detector manufacturers are losing ground with respect to US competitors. T2SL technology is an alternative to MCT for the manufacturing of IR FPAs. In the US, progress on T2SL FPA development led to up to 8K×8K IR FPAs demonstrations, but like US MCT ones, these are not easily available for the EU market due to strong export/ITAR restrictions. Moreover, US ROICs feature better performances and interfaces compared to their EU counterparts. The STEP project will provide a disruptive European supply chain fully focused on the design and manufacturing of competitive and affordable large format T2SL eSWIR FPAs. STEP will incorporate all steps of the IR FPA production chain: detector design, large scale growth, fabrication, hybridization, large format and high performances scalable ROIC with dedicated features to improve eSWIR space FPA performances, and evaluation of large space prototype FPAs (including space environment evaluation). STEP will benefit from a European complementary consortium team: Airbus, the well-known space industrial (requirements, performances testing, environment evaluation, space missions insertion and business plan), the European leader in T2SL manufacturing, IRnova (high performances eSWIR T2SL design & characterization, FPA space prototype manufacturing and non-space applications insertion), a world class RTO, Fraunhofer IAF (T2SL manufacturing and characterization), and a leader in aerospace research ISAE-SUPAERO (high performance large format ROIC design & validation and establishment of a EU large format digital space ROIC line).
more_vert assignment_turned_in Project2012 - 2017Partners:Gooch & Housego (United Kingdom), VIV, WWU, DTU, UPV +8 partnersGooch & Housego (United Kingdom),VIV,WWU,DTU,UPV,LISA laser products (Germany),Xenics,University of Nottingham,BBT,GHNHSFT,IRNOVA,University of Exeter,NKT PHOTONICS A/SFunder: European Commission Project Code: 317803more_vert Open Access Mandate for Publications and Research data assignment_turned_in Project2025 - 2028Partners:PT PORTUGAL TELECOM MEO, CEA, UEF, WEEBIT NANO, SORAMA +61 partnersPT PORTUGAL TELECOM MEO,CEA,UEF,WEEBIT NANO,SORAMA,GEOSYSTEMS HELLAS IT KAI EFARMOGESGEOPLIROFORIAKON SYSTIMATON ANONIMIETAIREIA,INNATERA NANOSYSTEMS BV,LOCSENSE B.V.,THALES DIS FRANCE SAS,ALMENDE,UNITY-SC,FRAUNHOFER,Technische Universität Braunschweig,ThingLink,Pfeiffer Vacuum (Germany),ST,IRNOVA,Grenoble INP - UGA,EMMTRIX,UPRC,UoA,SOITEC,AVCR,APPLIED MATERIALS ITALIA SRL,FOI,DTU,TECHNEXT,STGNB 2 SAS,University of Twente,MICRO-SENSYS GMBH,XGS,IFEVS,MARULLO SPA,ENDIIO ENGINEERING GMBH,IT,KNOWTION GMBH,UNIPV,IUNET,KOVILTA OY,GN STORE NORD,Aristotle University of Thessaloniki,KTH,RICCA IT,STRIKERSOFT,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,IMEC-NL,X-FAB Dresden,Pfeiffer Vacuum (France),FHG,UGA,TU Darmstadt,DANFOSS POWER ELECTRONICS AS,STM CROLLES,IMA,TÜBİTAK,IMMS GMBH,University of Seville,HALTIAN,ISD,STMicroelectronics (Switzerland),PICOSUN OY,UAB,UGA,UTIA,AMU,TU DelftFunder: European Commission Project Code: 101194172Overall Budget: 95,629,000 EURFunder Contribution: 25,010,700 EUREurope is poised to play a pivotal role in the technological revolution, particularly in the field of edge AI, which promises sustainable growth, performance, and reliability. The NeAIxt project is a strategic initiative designed to foster European independence and control over edge AI technology, benefiting both companies and citizens. The project presents a golden opportunity for European SMEs to grow, network, and enhance skills, leveraging exposure to the global market. Research labs and RTOs will bridge the gap to the future by developing necessary technologies and competencies, while universities will cultivate and disseminate advanced skills required for this technological evolution. NeAIxt aims to solidify Europe's position in edge AI and eNVM technology by enhancing AI enablers, evolving eNVM for edge applications, and demonstrating AI capabilities at both chip and system levels. The project is committed to ensuring the safety and security of AI services, adhering to EU regulations. Key technical developments include the advancement of 18nm FD-SOI and next-generation embedded Phase Change Memory (ePCM). These innovations will lead to high-performance, secure microcontrollers with AI capabilities, offering low power consumption and high security for smart applications. The project will integrate advances in non-volatile memory technologies with cutting-edge MCU design to enable efficient in-memory computing. This synergy will deliver a fully European solution for reliable, safe, and independent edge AI applications. NeAIxt will address the entire edge AI value chain, from academia to industry, and from design to end-user applications, building on Europe's strong technological foundation. The project's outcomes will alleviate societal concerns about AI proliferation by ensuring compliance with European privacy standards, fostering AI adoption in various sectors.
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