In line with industry needs, Moore’s law, scaling in ITRS 2013/2015, and ECSEL JU MASP 2016, the main objective of the TAKEMI5 project is to discover, develop and demonstrate lithographic, metrology, process and integration technologies enabling module integration for the 5 nm node. This is planned with available EUV/NA0.33 scanners that are optimized for mix and match with existing DUV/NA1.35 scanners, and with system design and development of a new hyper NA EUV lithography tool to enable more single exposure patterning at 5 nm to create complex integrated circuits. Process steps for modules in Front-end, Middle and Back-end of line are discovered and developed using the most advanced tool capabilities and they are evaluated morphologically and electrically using a relaxed test vehicle. During the development, specific challenges in metrology are assessed and metrology tools are upgraded or newly developed. The results are demonstrated in the imec pilot line with qualified metrology tools at the 5 nm node. The TAKEMI5 project relates to the ECSEL work program topic Process technologies – More Moore. It addresses and targets, as set out in the MASP, at a (disruptive) new Semiconductor Process, Equipment and Materials solutions for advanced CMOS processes that enable the module integration of electronic devices for the 5nm node in high-volume manufacturing and fast prototyping. The project touches the core of the continuation of Moore’s law which has celebrated its 50th anniversary. The cost aware development process supports the involved companies, and places them in an enhanced position for their worldwide competition. Through their worldwide affiliations, the impact of the TAKEMI5 project will be felt outside Europe in America and Asia Pacific semiconductor centers and is expected to benefit the European economy a lot by supporting its semiconductor equipment and metrology sectors with innovations, exports and employment.

The challenges and major HiCONNECTS objectives are to transform the centralized cloud platform to decentralized platforms which include edge cloud computing in a sustainable, energy-efficient way. This will bring cloud services including Artificial Intelligence (AI) closer to the IOT end-users, which enables them to really use the COT and IOT efficiently. The technologies underpinning this revolutionary step include the development of high-performance computing, storage infrastructure, network interfaces and connecting media , and the analysis of IOT sensors and big data in real-time. This major step forward will enable, for example, the mobile clients (during the 5G deployment phase and 6G exploration) to move among different places with minimum cost, short response time and with stable connection between cloud nodes and mobile devices. The main underlying technology to be developed by the HiCONNECTS consortium, comprising large industrial players, universities and RTO’s, and many SMEs, can be summarized under the title: ’heterogenous integration’ (HI) which is needed to meet the computing power, bandwidth, latency and sensing requirements for the next generation cloud and edge computing and applications. The HI revolution brings the electronic components and systems (ECS) into a new domain, which combines traditional silicon wafers integrated circuit (IC), InP based high speed electronics , and Si and InP photonics devices and interconnect. The HiCONNECTS ambition is to demonstrate, through HI development, a leap in computing and networking reliability and performances across the full vertical and horizontal ECS value chain (i.e. essential capabilities and key applications) in a sustainable way. In addition, HiCONNECTS will focus on the development of next generation design, algorithms, equipment (HW/SW), systems and Systems of Systems (SOS).