FirstTo6G assembles European SMEs and leading universities to develop the globally first 6G TRx technology, i.e., data converters and corresponding sub-THz frontends, which fulfils the extreme requirements for making 6G a widespread reality. These requirements include extremely wide modulation bandwidth at high signal quality, high energy efficiency, and low cost. Using a novel breakthrough microchip architecture, we will develop data converters with up to 16 GHz of modulation bandwidth, with extremely low power consumption, which are implemented in a commercial, low-cost 22nm semiconductor technology. We will also develop state-of-the-art frontend technology and integrate both parts to two full TRx solutions with unprecedented capabilities. The TRx for the frequencies <100 GHz will deliver 8 GHz of modulation bandwidth and will be realised in a monolithically integrated chip. The TRx for the frequency range of 130-175 GHz will deliver 16 GHz of modulation bandwidth and will integrate on PCB the data converters and the SiGe frontends using advanced packaging technologies. The D-band frontend will be designed based on a fully automated design flow. Key exploitable FirstTo6G results include designs for new technical concepts for data converters and the frontend, integration of high-performance TRx components in a single chip and automation algorithms for the design of frontends. We will use these results to develop and directly commercialise high performance mm-wave / early 6G products, as a basis for further research, or to spin-off new businesses. By making the widespread realisation of 6G possible, we will enable the highly positive contribution to prosperity of society which 6G will ultimately have. Critical technical knowledge will be developed and exploited in Europe by strongly growing SMEs, which will grow the communication microelectronics provider landscape, bolster the European microelectronics ecosystem and strengthen European technological sovereignty

PARALIA will enable an agile, low-cost, and energy-efficient multi-sensor combining Radar and Lidar technologies will re-architect the sensors ecosystem, upgrading their capabilities and enabling ultra-high resolution at ultra-long distances crucial for current and futuristic automotive and aerospace applications. To this end, a common Lidar/Radar optical multibeam beamforming platform will be developed based on the best-in-class multi-port linear optical Xbar architecture previously used for neuromorphic applications. For its implementation, PARALIA will utilize hybrid InP-SiN integration while leveraging a tight integration of InP components in multi-element arrays and the advances in SiN PZT optical phase shifters with μs-reconfiguration time, and low power consumption < 1uW. To demonstrate the universality of the developed optical multi-beam platform number of Lidar and Radar will be developed: i) Two multibeam Lidar modules featuring 120 degrees horizontal field of view (FOV) and 30 degrees vertical FOV and supporting 8 and 64 independent beams with 64 independent beams, based on 8 wavelengths - 8x8 XBar architecture. ii) Two multibeam Radar modules operating at K- and E- band for aerospace and automotive industries respectively. Both radar modules feature 120 degrees Vertical and Horizontal FOVs and support 8 independent beams iii) A multisensor module combining the Radar and Lidar modules with a processing unit employing a fusion ML algorithm developed to acquire and process the information coming from the multiple beams of the multi-sensor greatly enhancing its range and resolution.

The Chips JU project E2PackMan contributes to strengthen innovation and packaging production in Europe to improve the ecosystem for leading edge / advanced electronics. Integration of more functionality in smaller volume is still the major driver in microelectronics. In order to facilitate further miniaturization, assembly and packaging (A&P) is becoming of increasing importance for the value chain of a microelectronic product. To secure the future of electronic products "Made in Europe", we need a big push to strengthen innovation and production in the A&P sector. Thus E2PackMan will push materials research as well as innovative equipment and process developments. The focus of this research will be on catalyzing industrial production capabilities in Europe, both strengthening the production capabilities of the large semiconductor suppliers in Europe and creating a network that enables SMEs to produce their innovative devices in Europe. A world-class consortium of 60 partners from 13 European countries has been brought together to push advanced packaging in Europe towards heterogeneous system integration: The E2PackMan -EU project tackles a coherent approach that includes the whole value chain from material, process and technology developments validated by test-builds including the interface of the package to the chips and to the board/system.