Cynergy4MIE is a visionary project poised to revolutionize Europe's industrial landscape by bridging the gap between foundational technology layers, cross-sectional technologies, and key application areas. The project addresses the pressing need for efficient resource utilization and synergy creation across ecosystems. By actively managing requirements from various key application areas, Cynergy4MIE aims to steer developments in foundational technology layers and cross-sectional technologies, enabling unparalleled collaboration and resource optimization. This approach promises faster time-to-market, efficient resource utilization, and enhanced technological exchange between key application areas. Cynergy4MIE's strategy aligns with the EU's agenda and emphasizes urgency, resilience, technological partnerships, and cross-domain integration to champion European competitiveness. The project's long-term impact rests on embracing urgency, fostering competitive resilience, strengthening technological partnerships, harnessing ecosystem synergies, promoting cross-domain integration, advancing AI competence, prioritizing sustainability, enhancing productivity, and ensuring user-centric digitalization while forming strategic alliances. Cynergy4MIE envisions a future where emergent cyber-physical systems serve human-centric needs, drive domain convergence, and secure Europe's position as a global technology leader.

The objective of the ACT10 project is to develop and demonstrate the required technology options, including their integration, for the 10Ångstrom node. The 32 participating partners cover a wide range of activities along the entire value chain for the manufacturing of CMOS chips. Activities include equipment development, computer aided design tooling and process technology development. Essential parts of hardware, software and processing technology are developed pushing the boundaries of semiconductor design and manufacture to enable the new node and keep Moore’s law alive. The project aims to enhance the attractiveness of the EU as a location for new cutting-edge high volume and legacy node fabs. The ACT10 project is built based on the following four pillars. 1. Lithography Equipment and Mask Technology: Increase key-performance indicators in the optical system of High-NA Lithography machines, along with developing advanced mask processes and equipment to reach optical imaging requirements, and nonlinear optics material lifetime effects. 2. Chip design and Block Level validation; Assessment of different CFET devices and evaluate building blocks for digital and analog IPs. 3. Process Technology: development of innovative solutions for routing of the stacked n- and p-devices of the CFET architecture, development of 0.55NA (high-NA) single patterning solutions, and the development of semi-damascene BEOL for the 10Å node. 4. Computational Metrology and Process Monitoring Equipment: develop computational metrology methods, and develop metrology and inspection modules and equipment.

The Chips JU project E2PackMan contributes to strengthen innovation and packaging production in Europe to improve the ecosystem for leading edge / advanced electronics. Integration of more functionality in smaller volume is still the major driver in microelectronics. In order to facilitate further miniaturization, assembly and packaging (A&P) is becoming of increasing importance for the value chain of a microelectronic product. To secure the future of electronic products "Made in Europe", we need a big push to strengthen innovation and production in the A&P sector. Thus E2PackMan will push materials research as well as innovative equipment and process developments. The focus of this research will be on catalyzing industrial production capabilities in Europe, both strengthening the production capabilities of the large semiconductor suppliers in Europe and creating a network that enables SMEs to produce their innovative devices in Europe. A world-class consortium of 60 partners from 13 European countries has been brought together to push advanced packaging in Europe towards heterogeneous system integration: The E2PackMan -EU project tackles a coherent approach that includes the whole value chain from material, process and technology developments validated by test-builds including the interface of the package to the chips and to the board/system.

We are surrounded by a variety of more-or-less intelligent technical devices, designed to serve you us or others. Applications onin your mobile phones, wrist-worn health sensors on your wrists, autonomous vacuum cleaners, robots on the factory floor and increasingly autonomous cars – all pledge to ease your tasks and keep usyou safe and healthy. SThe seamless interplay with these devices gets gainsmore importane as these devices proliferate and grow in t with the increased autonomy and pervasive presence of the devices. We expect continuously available support fromin the services they provide − yet we want them to disappear unobtrusively in the background when not needed. In order to provide support in a collaborative environment with human, physical and digital players, the technology needs to be equipped with senses to grasp human presence, their mental and physical state, their activities and their intentions. This is required to ensure human safety, safeguard their health, and allow for natural interaction. This project intends to improve sensing of human presence, behaviour and health in a collaborative or common environment by means of multi-sensor systems.

14ACMOS is about enabling manufacture of 14A Semiconductor technology. It addresses the 4 key pillars in IC technology development for manufacture; Lithography, Metrology, Mask Infrastructure and Process technology. Carl ZEISS, Trumpf and ASML are the main parties to push the lithography solutions to 14A. Between Carl ZEISS, Fraunhofer, RWTH, UW and TNO further understanding of optics life time and plasma physics is pursued in optimizing optics transmission and lifetime. Nova, BRT, ILT and PTB address measurement sensitivity enhancement of X-ray and optical based methodologies to meet the 14A requirements. Imec, TNO, PTB, UPB and RWTH will combine and tune metrology techniques specifically for the assessment of EUV reticle degradation. On throughput and resolution enhancement Bruker, EXC, PTB and AMIL will work on X-ray sources and AMIL, ICT and NFI on e-beam and SPM platforms for in-line metrology. On the reduction of Total Measurement Uncertainty, Prodrive and AMIL cover the development of an ultra-high precision wafer stage and NVIDIA, AMIL and Prodrive the development of a next generation image processing system. In Mask Infrastructure there are FHG (IISB), ASML, Carl Zeiss covering the creation of a simulation based mask repair strategy and with Carl ZEISS, ASML, PI and UPB HW/SW and process technology for particle removal is created and repair durability is covered with Carl ZEISS, ASML, Suss and UPB. Process technology covers the creation of patterning solutions with the involvement of imec and TEL. On active device selection there will be imec, Cadence, IBS, JSR, Recif and TEL with THERMO enabling advanced TEM characterization. Middle Of Line and Back End Of Line solution development is with imec, TEL, Solmates and Coventor for process modules and Cadence the interface with the design community. On Sustainable Semiconductor Technology and Systems there are imec, Recif and ThermoFisher covering sustainable material and processing alternatives.