
MENTOR GRAPHICS DEVELOPMENT CROLLES SARL
MENTOR GRAPHICS DEVELOPMENT CROLLES SARL
6 Projects, page 1 of 2
- CEA,STM CROLLES,MIY,DPE,FEI,CSIC,FUNDACION CIDETEC,LAM,ASML (Netherlands),MENTOR GRAPHICS DEVELOPMENT CROLLES SARL,IMEC,JSR MICRO NVFunder: European Commission Project Code: 120011
more_vert assignment_turned_in Project2012 - 2015Partners:GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, CEA, University of Twente, eSilicon Romania SRL, EAB +18 partnersGLOBALFOUNDRIES Dresden Module One LLC & Co. KG,CEA,University of Twente,eSilicon Romania SRL,EAB,Bruco IC,STM CROLLES,IMEC,STGNB 2 SAS,UCL,Axiom IC B.V.,Dolphin Design (France),ST-ERICSSON OY,FZJ,STMicroelectronics (Switzerland),MENTOR GRAPHICS DEVELOPMENT CROLLES SARL,adixen,ST-ERICSSON,Ibs (France),Grenoble INP - UGA,SOITEC,Acreo,STFunder: European Commission Project Code: 325633more_vert assignment_turned_in Project2014 - 2018Partners:ZMD, Ericsson, SORIN GROUP, IMA, TÜBİTAK +41 partnersZMD,Ericsson,SORIN GROUP,IMA,TÜBİTAK,MunEDA,WUT,EASII IC,ICDIP,ATRENTA FRANCE SAS,STGNB 2 SAS,DOCEA POWER,IGN,UTIA,METAIO,AVCR,TEKNOLOGIAN TUTKIMUSKESKUS VTT OY,UNIVERSITE BORDEAUX I,Grenoble INP - UGA,CEA,Cadence Design Systems (United States),M3S,ADR CMP,STFC,NXP,dxo labs,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,University of Tübingen,ISD,Magillem Design Services,EADS DEUTSCHLAND GMBH,D&R,ST,AIRBUS DS SAS,IT,DXO SIG,MENTOR GRAPHICS DEVELOPMENT CROLLES SARL,FHG,TIEMPO SAS,STMicroelectronics (Switzerland),ASYGN,Dolphin Design (France),DCT,MISSING_LEGAL_NAME,Cadence Design Systems (Germany),EUROPEAN AERONAUTIC DEFENCE AND SPACE COMPANY EADS FRANCE SASFunder: European Commission Project Code: 621221more_vert assignment_turned_in Project2012 - 2017Partners:STM CROLLES, POLYTEC GMBH, CEA, NXP, THALES +12 partnersSTM CROLLES,POLYTEC GMBH,CEA,NXP,THALES,UCC,IMEC,UPSud,III V Lab,AIFOTEC AG,SI2, INC,ST,PHOENIX,AIFOTEC AG,MENTOR GRAPHICS DEVELOPMENT CROLLES SARL,STMicroelectronics (Switzerland),TNOFunder: European Commission Project Code: 318178more_vert Open Access Mandate for Publications assignment_turned_in Project2019 - 2022Partners:NFI, Ippon Innovation, ICOS, AVL DITEST GMBH, CEA +47 partnersNFI,Ippon Innovation,ICOS,AVL DITEST GMBH,CEA,OCTO TECHNOLOGY,FEI,PVA-AS,Mellanox Technologies (Israel),ICT Integrated Circuit Testing GmbH,COMETA SPA,TU/e,POLITO,NOVA LTD,University of Bucharest,BMWi,TOWER SEMICONDUCTOR LTD,FIAT GROUP AUTOMOBILES SPA FIAT AUTO SPA,PTB,BRILLIANETOR LTD,STMicroelectronics (Switzerland),PRODRIVE BV,Mellanox Technologies (United States),Excillum (Sweden),THERMO FISHER SCIENTIFIC (BREMEN) GMBH,Nanomotion (Israel),AMIL,GLOBALFOUNDRIES Dresden Module One LLC & Co. KG,CNR,IMT,SIEMENS ELECTRONIC DESIGN AUTOMATION SARL,ECP,OKO,AMU,TU Delft,KLA,VIF,Arkema (France),Pfeiffer Vacuum (France),SEMI Europe,Pfeiffer Vacuum (Germany),STM CROLLES,IMEC,UNITY-SC,Jordan Valley Semiconductors (Israel),TNO,AVL,SEMILAB ZRT,MENTOR GRAPHICS DEVELOPMENT CROLLES SARL,CNRS,Stellantis (Netherlands),STFunder: European Commission Project Code: 826589Overall Budget: 126,895,000 EURFunder Contribution: 29,382,500 EURThe metrology domain (which could be considered as the ‘eyes and ears’ for both R&D&I and production) is a key enabler for productivity enhancements in many industries across the electronic components and system (ECS) value chain and have to be an integral part of any Cyber Physical Systems (CPS) which consist of metrology equipment, virtual metrology or Industrial internet of things (IIoT) sensors, edge and high-performance computing (HPC). The requirements from the metrology is to support ALL process steps toward the final product. However, for any given ECS technology, there is a significant trade-off between the metrology sensitivity, precision and accuracy to its productivity. MADEin4 address this deficiency by focusing on two productivity boosters which are independent from the sensitivity, precision and accuracy requirements: • Productivity booster 1: High throughput, next generation metrology and inspection tools development for the nanoelectronics industry (all nodes down to 5nm). This booster will be developed by the metrology equipment’s manufacturers and demonstrated in an industry 4.0 pilot line at imec and address the ECS equipment, materials and manufacturing major challenges (MASP Chapter 15, major challenges 1 – 3). • Productivity booster 2: CPS development which combines Machine Learning (ML) of design (EDA) and metrology data for predictive diagnostics of the process and tools performances predictive diagnostics of the process and tools performances (predictive yield and tools performance). This booster will be developed and demonstrated in an industry 4.0 pilot line at imec, for the 5nm node, by the EDA, computing and metrology partners (MASP Chapter 15, major challenge 4). The same CPS concept will be demonstrated for the ‘digital industries’ two major challenges of the nanoelectronics (all nodes down to 5nm) and automotive end user’s partners (MASP Chapter 9, major challenges 1and 3).
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