Cloud storage and computing, big data analytics and social media are driving the need for higher bandwidth communications in data centres (DCs). Concurrently, disaggregation and virtualization trends in the DC are forcing the traffic to be between servers and storage elements in the east-west direction. These changes require massive switching capabilities from the discrete switch elements. However, the technology is rapidly reaching a limit. The result is a multi-layered DC topology with high power consumption and long latency. The L3MATRIX project provides novel technological innovations in the fields of silicon photonics (SiP) and 3D device integration. The project will develop a novel SiP matrix with a scale larger than any similar device with more than 100 modulators on a single chip and will integrate embedded laser sources with a logic chip thus breaking the limitations on the bandwidth-distance product. Use of embedded laser sources and integration with a full logic CMOS chip are innovative steps that will have a profound effect on the European market as these technologies will make a noticeable change in the power consumption, performance and cost of DCs. A novel approach will be used with embedded III-V sources on the SOI substrate which will eliminate the need to use an external light source for the modulators. L3MATRIX provides a new method of building switching elements that are both high radix and have an extended bandwidth of 25 Gb/s in single mode fibres and waveguides with low latency. The power consumption of DC networks built with these devices is 10-fold lower compared to the conventional technology. The outcome of this approach is that large networks, in the Pb/s scale can be built as a single stage, non-blocking network. The single mode nature of the SiP chip allows scaling the network to the 2000 m range required in modern DCs.

MASSTART aims to provide a holistic transformation to the assembly and characterization of high speed photonic transceivers towards bringing the cost down to €1/Gb/s or even lower in mass production. This will guarantee European leadership in the Photonics industry for the next decade. MASSTART will surpass the cost metric threshold by using enhanced and scalable techniques: i) glass interface based laser/PIC and fiber/PIC coupling approaches, leveraging glass waveguide technology to obtain spot size and pitch converters in order to dramatically increase optical I/O density, while facilitating automated assembly processes, ii) 3D packaging (TSV) enabling backside connection of the high speed PIC to a Si carrier iii) a new generation of flip chip bonders with enhanced placement in a complete assembly line compatible with Industry 4.0 which will guarantee an x6 improvement in throughput and iv) wafer-level evaluation of assembled circuits with novel tools that will reduce the characterization time by a factor of 10, down to 1 minute per device. This process flow will be assessed with the fabrication and characterization of four different demonstrators, addressing the mid-term requirements of next generation transceivers required by Data Center operators and covering both inter- and intra- Data Center applications. These demonstrators are: i) a 4-channel PSM4 module in QSFP-DD format with 400G aggregate bit rate, ii) an 8-channel WDM module in a QSFP-DD format with 800G aggregate bit rate, iii) a 16-channel WDM on-board module delivering 1.6Tb/s aggregate line rate and iv) a tunable single-wavelength coherent transceiver with 600Gb/s capacity following the DP-64QAM modulation format on 64Gbaud/s line rate. Finally, MASSTART will interact closely with international bodies to ensure the compliance and standardization of the developed technology with other proposed packaging form factors for rapid commercialization.

A revolution is taking place in the field of satellite systems, as more satellites have been launched into orbit in the last 5 years then in the last 6 decades combined. The main reason for this is because satellites are now affordable to manufacture and the new generation of satellites orbit at much lower altitudes – sparking new opportunities in communications and Earth Observations (EO). The MWP4SPACE IDN will train the next generation of specialists in Integrated Microwave Photonic (IMWP) devices and systems in the framework of satellite and space applications. They will gain skills to integrate compact photonic and radio frequency (RF) circuits, and cutting-edge knowledge of photonic integrated circuit (PIC) design, fabrication, packaging, validation and qualification both at the device and system level – competences for which there is a fast-growing demand in the global satellite industry, but that are rarely taught in an integrated training program. Importantly, those skills are deemed essential to achieve the scientific goals of the program, which are to develop, introduce and promote IMWP technologies for secure and reconfigurable networks of LEO- and MEO satellites for telecommunications (SATCOM) and EO. MWP4SPACE will offer a unique education program for 15 young researchers structured in research projects and network-wide training activities and delivered by 6 European Universities, 1 non-profit academic research institutions and 9 companies which are world-class references in both photonics and space technologies. By positioning MWP4SPACE DCs as key actors in the transfer of knowledge developed for terrestrial applications to space applications, our training network will significantly contribute to their employability by placing them as future leaders in the next generation of SATCOM and EO technologies.

InP photonic integrated circuits (PICs) offer game changing performance capabilities across multiple market sectors. Alas, the possibilities have so far been restricted to a small number of vertically-integrated technology businesses. Europe boasts tens of innovative businesses who are positioned to develop PIC-enabled technologies , but – alas again – they do not have access to mature, fast-turnaround predictable, high performance production. InPulse is a manufacturing pilot line for InP PICs which will transform the PIC industry from a vertically integrated model with all skills in-house within a small number of specialized businesses, to an open-access horizontal model accessible to all European innovators. InPulse puts in place the technological and operational processes to: 1) Accelerate the uptake of PIC technology in new markets: enabling SMEs to create tens of products in markets where PICs have not be used before. 2) Enable sustainable production in Europe creating aligned, scalable and inter-locking services and value chains 3) Accelerate time to market from years to under 24 months with predictive design for fewer and faster product design cycles 4) Qualify foundry processes, to TRL7, sharing process optimization across products InPulse combines low entrance-threshold, mature-manufacturing to enable tens of European PIC innovators. InPulse is validated by: • A “Pilot Line Validation Program” with two Participants stretching performance • A “Demonstrator Open Call” program enabling external users to take thirty designs to pre-production • High frequency open access calls, sustainable beyond the end of the project InPulse partners have played a pioneering role in open access InP PICs, creating an infrastructure for research and early stage development. We are very well positioned to enable high TRL development in a scalable design kit driven process driving open access InP PICs from proof of concept to industrial prototyping and pre-production.