
LPE
7 Projects, page 1 of 2
Open Access Mandate for Publications assignment_turned_in Project2015 - 2018Partners:PICOSUN OY, NANODESIGN, CNR, POLITO, LPE +6 partnersPICOSUN OY,NANODESIGN,CNR,POLITO,LPE,IUNET,UniPi,ASM EUROPE,STMicroelectronics (Switzerland),ASM EUROPE BV,Besi Netherlands BVFunder: European Commission Project Code: 653933Overall Budget: 8,173,780 EURFunder Contribution: 2,060,270 EURR2POWER300 is committed to challenge the following Objectives: • Development and manufacturing of a multi-KET Pilot Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing) • Energy Efficiency and CO2 Reduction megatrends. The project aims to achieve the following Goals: 1. Set the stage for the future extension to 300mm of the R2 Fab facility located in Agrate Brianza (Italy) - i.e. line’s specification, tools’ evaluation and screening, new process’s optimization and characterization, etc. 2. To evaluate, characterize and optimize the equipments and process necessary to achieve the new BCD10 technology, featuring 90nm lithography, at 300mm wafer size. BCD (i.e. Bipolar + CMOS + DMOS) is a unique smart power technology invented by ST in the mid ‘80s (CMOS’s gate length was 4 m at that time!). As of today BCD is one of the key technology assets of ST and the indefatigable evolution and challenging roadmap makes ST a world-class leader on smart power ICs. 3. Advanced System in Packages: some SiP activity will be performed, with specific reference to Sintering based die-attach, thermal analysis and dedicated packaging solution for high density ALD capacitors.
more_vert assignment_turned_in Project2010 - 2013Partners:Aristotle University of Thessaloniki, CCR, UNICAL, SiCrystal AG, SSC +9 partnersAristotle University of Thessaloniki,CCR,UNICAL,SiCrystal AG,SSC,CNR,CSIC,MISSING_LEGAL_NAME,Acreo,LPE,NOVASiC (France),STMicroelectronics (Switzerland),IWC PAN,FOUNDATION FOR RESEARCH AND TECHNOLOGYHELLASFunder: European Commission Project Code: 120218more_vert Open Access Mandate for Publications assignment_turned_in Project2018 - 2023Partners:CNR, SIEC BADAWCZA LUKASIEWICZ - INSTYTUT MIKROELEKTRONIKI I FOTONIKI, HQ-Dielectrics (Germany), APPLIED MATERIALS IRELAND LIMITED, II-VI GMBH +26 partnersCNR,SIEC BADAWCZA LUKASIEWICZ - INSTYTUT MIKROELEKTRONIKI I FOTONIKI,HQ-Dielectrics (Germany),APPLIED MATERIALS IRELAND LIMITED,II-VI GMBH,FORES,Ikerlan,IPD,LPE,NANODESIGN,LAM RESEARCH SAS,algoWatt,UNIPA,IUNET,ELFOREST AB,APPLIED MATERIALS GMBH,STMICROELECTRONICS SILICON CARBIDE AB,JSR MICRO NV,University of Bucharest,EVATEC AG,University of Zaragoza,STU,MIUN,LAM,AMIL,APPLIED MATERIALS ITALIA SRL,Disco (Germany),CENTROTHERM INTERNATIONAL AG,DACPOL SP. Z O.O.,STMicroelectronics (Switzerland),EVGFunder: European Commission Project Code: 783158Overall Budget: 49,767,700 EURFunder Contribution: 10,402,000 EURREACTION will push through the first worldwide 200mm Silicon Carbide (SiC) Pilot Line Facility for Power technology. This will enable the European industry to set the world reference of innovative and competitive solutions for critical societal challenges, like Energy saving and CO2 Reduction as well as Sustainable Environment through electric mobility and industrial power efficiency. Establishing the first 200mm SiC Pilot Line in the world and developing the most innovative and cost competitive technology, this project will address mass-market applications like smart energy and smart mobility, and industrial. It will allow to meet the more and more increasing demand of requirements in terms of quality and cost constraint for next decade generation’s power electronics. The Project strength is the complete Pilot Line value chain implementation, integrating and optimizing partnership in the fields of SiC equipment developers, SiC process technologists, RTOs, and end users partners till the final applications context. This will allow to develop a full 8” SiC line ecosystem enhancing the competitiveness of EU- Industries down to the value chain in a market context where other countries today, such as the USA or Japan, are just starting to play on 6” SiC market. Innovative SiC power device Performances improvements, together with cost and size reductions, are the most relevant challenges addressed in the project that are expected to lead to a new stronger European supply chain for very compact SiC converters, from 600V to 2.2kV range, ideal for the addressed applications; the ambition is therefore to play a primary role towards excellence in Europe by a first generations of 8” SiC profitable Smart Mobility and Smart Energy products and components, primary access to IPs for the relevant essential capabilities, competitiveness of manufacturing in Europe.
more_vert Open Access Mandate for Publications assignment_turned_in Project2016 - 2019Partners:Elmos Semiconductor (Germany), Semikron (Germany), IT, TUD, Robert Bosch (Germany) +33 partnersElmos Semiconductor (Germany),Semikron (Germany),IT,TUD,Robert Bosch (Germany),Polytechnic University of Milan,SYSTEMA,AIT,Hochschule Mittweida,TUW,Infineon Technologies (Austria),MCL,IFD,Schiller Automatisierungstechnik GmbH,PLANSEE SE,PMX,Know Center,FHG,University of Aveiro,MLAB,Ibs (France),CMF,ifak e. V. Magdeburg,NANIUM S.A.,IFKL,AAU,FhA,Fabmatics (Germany),Infineon Technologies (Germany),KAI,UNIPV,AVL,AT&S (Austria),VIF,LPE,Roth & Rau - Ortner GmbH,znt Zentren für Neue Technologien GmbH,HOCHSCHULE FUR ANGEWANDTE WISSENSCHAFTEN BURGENLAND GMBHFunder: European Commission Project Code: 692466Overall Budget: 61,919,600 EURFunder Contribution: 12,227,400 EURAddressing European Policies for 2020 and beyond the “Power Semiconductor and Electronics Manufacturing 4.0” (SemI40) project responds to the urgent need of increasing the competitiveness of the Semiconductor manufacturing industry in Europe through establishing smart, sustainable, and integrated ECS manufacturing. SemI40 will further pave the way for serving highly innovative electronic markets with products powered by microelectronics “Made in Europe”. Positioned as an Innovation Action it is the high ambition of SemI40 to implement technical solutions on TRL level 4-8 into the pilot lines of the industry partners. Challenging use cases will be implemented in real manufacturing environment considering also their technical, social and economic impact to the society, future working conditions and skills needed. Applying “Industry 4.0”, “Big Data”, and “Industrial Internet” technologies in the electronics field requires holistic and complex actions. The selected main objectives of SemI40 covered by the MASP2015 are: balancing system security and production flexibility, increase information transparency between fields and enterprise resource planning (ERP), manage critical knowledge for improved decision making and maintenance, improve fab digitalization and virtualization, and enable automation systems for agile distributed production. SemI40’s value chain oriented consortium consists of 37 project partners from 5 European countries. SemI40 involves a vertical and horizontal supply chain and spans expertise and partners from raw material research, process and assembly innovation and pilot line, up to various application domains representing enhanced smart systems. Through advancing manufacturing of electronic components and systems, SemI40 contributes to safeguard more than 20.000 jobs of people directly employed in the participating facilities, and in total more than 300.000 jobs of people employed at all industry partners’ facilities worldwide.
more_vert Open Access Mandate for Publications and Research data assignment_turned_in Project2023 - 2025Partners:DEEP CONCEPT, Ikerlan, GAMESA ELECTRIC, University Federico II of Naples, ABB +3 partnersDEEP CONCEPT,Ikerlan,GAMESA ELECTRIC,University Federico II of Naples,ABB,CNR,LPE,MERSEN ANGERSFunder: European Commission Project Code: 101075709Overall Budget: 4,001,420 EURFunder Contribution: 3,242,370 EURFor a larger deployment of clean and sustainable energies more efficient and competitive converter solutions are necessary. In this framework, wide Bandgap (WBG) technology provides benefits compared to conventional silicon technology. Even those benefits are well known, e.g. efficiency and/or sufficient reduction on converter footprint, right now SiC are far too expensive and its cost has a negative impact on overall system cost. In the view of this situation, the objective of AdvanSiC is to produce, test and validate cost-effective HV SiC MOSFET semiconductors in various MVDC grid applications: a solid-state circuit breaker for DC converter stations, a full-scale wind converter and a full-scale solar inverter. The aim is to minimize HV SiC device cost by advanced design structures and process optimizations. And afterwards, assure an immune and reliable environment to handle SiC fast transients, as well as optimize passives and cooling system to provide cost reduction not only at device level but also at system level. The main goal of AdvanSiC is to provide industrial leadership in key and emerging technologies to SMEs, start-ups, and industry from Europe to Europe, specifically in a technology that will be key to provide clean and affordable energy.
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