
STMicroelectronics (France)
STMicroelectronics (France)
2 Projects, page 1 of 1
assignment_turned_in Project2007 - 2010Partners:Silistix Ltd, ST Microelectronics, University of Bristol, Silistix Ltd, Xilinx Corp +3 partnersSilistix Ltd,ST Microelectronics,University of Bristol,Silistix Ltd,Xilinx Corp,University of Bristol,Xilinx (United States),STMicroelectronics (France)Funder: UK Research and Innovation Project Code: EP/E062164/1Funder Contribution: 282,919 GBPThe purpose of this work is to investigate an on-chip network fabric that will enable future reconfigurable computing systems integrating tens or hundreds of processing tiles implementing embedded microprocessors, intellectual property cores, reconfigurable fabrics, dedicated local memories and DSP functionality. The reconfigurable NoC fabric will direct the effective communication and exchange of data among the multiple processing tiles and enable fault-tolerance and very high communication bandwidths with low-latency and low energy consumption. The processing tiles will morph their functionality and operation point based on the application demands.
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For further information contact us at helpdesk@openaire.euassignment_turned_in Project2008 - 2011Partners:The University of Manchester, University of Salford, Xilinx (United States), University of Manchester, ST Microelectronics +4 partnersThe University of Manchester,University of Salford,Xilinx (United States),University of Manchester,ST Microelectronics,Silistix Ltd,Silistix Ltd,Xilinx Corp,STMicroelectronics (France)Funder: UK Research and Innovation Project Code: EP/E06065X/1Funder Contribution: 319,957 GBPThe purpose of this work is to investigate an on-chip network fabric that will enable future reconfigurable computing systems integrating tens or hundreds of processing tiles implementing embedded microprocessors, intellectual property cores, reconfigurable fabrics, dedicated local memories and DSP functionality. The reconfigurable NoC fabric will direct the effective communication and exchange of data among the multiple processing tiles and enable fault-tolerance and very high communication bandwidths with low-latency and low energy consumption. The processing tiles will morph their functionality and operation point based on the application demands.
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